TN0610N3-G Microchip

TN0610 N-Channel Enhancement-Mode Vertical DMOS FET Features General Description 2V Maximum Low Threshold The TN0610 low-threshold Enhancement-mode (normally-off) transistor uses a vertical DMOS structure High Input Impedance and a well-proven silicon-gate manufacturing process. 100 pF Typical Low Input Capacitance This combination produces a device with the power Fast Switching Speeds handling capabilities of bipolar transistors and the high Low On-Resistance input impedance and positive temperature coefficient Free from Secondary Breakdown inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and Low Input and Output Leakage thermally induced secondary breakdown. Applications Microchips vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications Logic-Level Interfaces (Ideal for TTL and CMOS) where very low threshold voltage, high breakdown Solid-State Relays voltage, high input impedance, low input capacitance, Battery-Operated Systems and fast switching speeds are desired. Photovoltaic Drives Analog Switches General Purpose Line Drivers Telecommunication Switches Package Type 3-lead TO-92 (Top view) DRAIN SOURCE GATE See Table 3-1 for pin information. 2020 Microchip Technology Inc. DS20006418A-page 1TN0610 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Drain-to-Source Voltage ...................................................................................................................................... BV DSS Drain-to-Gate Voltage ......................................................................................................................................... BV DGS Gate-to-Source Voltage ......................................................................................................................................... 20V Operating Ambient Temperature, T ................................................................................................... 55C to +150C A Storage Temperature, T ..................................................................................................................... 55C to +150C S Notice: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: T = 25C unless otherwise specified. All DC parameters are 100% tested at 25C unless A otherwise stated. (Pulse test: 300 s pulse, 2% duty cycle) Parameter Sym. Min. Typ. Max. Unit Conditions Drain-to-Source Breakdown Voltage BV 100 V V = 0V, I = 1 mA DSS GS D Gate Threshold Voltage V 0.6 2 V V = V , I = 1 mA GS(th) GS DS D V = V , I = 1 mA GS DS D Change in V with Temperature V 4.5 mV/C GS(th) GS(th) (Note 1) Gate Body Leakage Current I 100 nA V = 20V, V = 0V GSS GS DS V = 0V, V = Maximum GS DS 10 A rating Zero-Gate Voltage Drain Current I V = 0.8 Maximum rating, DSS DS 1 mA V = 0V, T = 125C GS A (Note 1) 1.2 2 A V = 5V, V = 25V GS DS On-State Drain Current I D(ON) 3 6.7 A V = 10V, V = 25V GS DS 15 V = 3V, I = 250 mA GS D Static Drain-to-Source On-State Resistance R 1.5 2 V = 5V, I = 750 mA DS(ON) GS D 1 1.5 V = 10V, I = 750 mA GS D V = 10V, I = 750 mA GS D Change in R with Temperature R 0.75 %/C DS(ON) DS(ON) (Note 1) Note 1: Specification is obtained by characterization and is not 100% tested. DS20006418A-page 2 2020 Microchip Technology Inc.