Product Information

M28W640HCB70ZB6E

M28W640HCB70ZB6E electronic component of Micron

Datasheet
NOR Flash Parallel 3V/3.3V 64M-bit 4M x 16 70ns 48-Pin TFBGA Tray

Manufacturer: Micron
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

3: USD 4.8704 ea
Line Total: USD 14.61

0 - Global Stock
MOQ: 3  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 3
Multiples : 1
3 : USD 4.8704

     
Manufacturer
Product Category
Mounting Style
Package / Case
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Access Time Max
Address Bus
Boot Type
Cell Type
Operating Temp Range
Pin Count
Density
Operating Temperature Classification
Programmable
Rad Hardened
Operating Supply Voltage Typ
Deleted
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M28W640HCT M28W640HCB 64 Mbit (4 Mb x 16, boot block) 3 V supply Flash memory Features Supply voltage V = 2.7 V to 3.6 V DD FBGA V = 12 V for fast program (optional) PP Access times: 70 ns Asynchronous Page Read mode TFBGA48 (ZB) Page width: 4 words 6.39 x 10.5 mm Page access: 25 ns Random access: 70 ns Programming time: 10 s typical Double Word Programming option Quadruple Word Programming option TSOP48 (N) Common Flash interface 12 x 20 mm Memory blocks Parameter blocks (top or bottom location) Packages Main blocks RoHS compliant Block locking All blocks locked at power-up Any combination of blocks can be locked WP for block lock-down Security 128 bit user programmable OTP cells 64 bit unique device identifier Automatic standby mode Program and Erase Suspend 100,000 program/erase cycles per block Electronic signature Manufacturer code: 20h Top device code, M28W640HCT: 8848h Bottom device code, M28W640HCB: 8849h November 2008 Rev 3 1/72 www.numonyx.com 1Contents M28W640HCT, M28W640HCB Contents 1 Description . 7 2 Signal descriptions . 12 2.1 Address inputs (A0-A21) . 12 2.2 Data input/output (DQ0-DQ15) . 12 2.3 Chip Enable (E) 12 2.4 Output Enable (G) 12 2.5 Write Enable (W) . 12 2.6 Write Protect (WP) 12 2.7 Reset (RP) 13 2.8 V supply voltage 13 DD 2.9 V program supply voltage . 13 PP 2.10 V ground 13 SS 3 Bus operations 14 3.1 Read . 14 3.2 Write . 14 3.3 Output Disable . 14 3.4 Standby 14 3.5 Automatic Standby 15 3.6 Reset 15 4 Command interface . 16 4.1 Read Memory Array command 16 4.2 Read Status Register command 16 4.3 Read Electronic Signature command 16 4.4 Read CFI Query command . 17 4.5 Block Erase command . 17 4.6 Program command 18 4.7 Double Word Program command . 18 4.8 Quadruple Word Program command 19 4.9 Clear Status Register command 19 2/72

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
EL9
Elpida Memory
ELPIDA MEMORY INC
IE6
MI9
MICRON SEMICONDUCTOR
Micron Tech
MICRON TECHNOLOGY
Micron Technology Inc
Micron Technology Inc.
NU9
Numonyx - A DIVISION OF MICRON SEMICONDUCTOR PRODUCTS, INC. (VA)

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