Product Information

MT18KSF2G72HZ-1G6A2

MT18KSF2G72HZ-1G6A2 electronic component of Micron

Datasheet
DRAM Module DDR3L SDRAM 16Gbyte 204SODIMM

Manufacturer: Micron
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

100: USD 406.0219 ea
Line Total: USD 40602.19

0 - Global Stock
MOQ: 100  Multiples: 100
Pack Size: 100
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 100
Multiples : 100
100 : USD 406.0219

     
Manufacturer
Product Category
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
MT18RTF25672FDZ-667H1D6 electronic component of Micron MT18RTF25672FDZ-667H1D6

DRAM Module DDR2 SDRAM 2Gbyte 240FBDIMM
Stock : 0

MT25QL01GBBB8E12-0AAT electronic component of Micron MT25QL01GBBB8E12-0AAT

NOR Flash Serial-SPI 3V 1Gbit 1024M/512M/256M 1bit/2bit/4bit 6ns 24-Pin TBGA
Stock : 1351

MT18VDDT6472AG40BG4 electronic component of Micron MT18VDDT6472AG40BG4

DRAM Module DDR SDRAM 512Mbyte 184UDIMM Tray
Stock : 0

MT18KSF51272AZ-1G6K1 electronic component of Micron MT18KSF51272AZ-1G6K1

DRAM Module DDR3L SDRAM 4Gbyte 240UDIMM
Stock : 0

MT18KSF51272HZ-1G6K2 electronic component of Micron MT18KSF51272HZ-1G6K2

DRAM Module DDR3L SDRAM 4Gbyte 204SODIMM
Stock : 0

MT18KSF51272PZ-1G6K1 electronic component of Micron MT18KSF51272PZ-1G6K1

Memory Modules DDR3 4GByte RDIMM
Stock : 0

MT25QL01GBBA8E12-0SIT electronic component of Micron MT25QL01GBBA8E12-0SIT

NOR Flash Serial-SPI 3V 1Gbit 1024M/512M/256M x 1bit/2bit/4bit 6ns 24-Pin TBGA
Stock : 0

MT25QL01GBBB8E12-0AUT electronic component of Micron MT25QL01GBBB8E12-0AUT

NOR Flash SPI FLASH NOR SLC 256MX4 TBGA DDP
Stock : 4045

MT25QL01GBBB1EW9-0SIT electronic component of Micron MT25QL01GBBB1EW9-0SIT

NOR Flash SPI FLASH NOR SLC 256MX4 WPDFN DDP
Stock : 1250

MT25QL01GBBB8E12-0AUT TR electronic component of Micron MT25QL01GBBB8E12-0AUT TR

NOR Flash SPI FLASH NOR SLC 256MX4 TBGA DDP
Stock : 4818

Image Description
EFM542-M291I* electronic component of Teledyne EFM542-M291I*

EFM542M291I teledyne
Stock : 2

101-10-S electronic component of On Shore Technology 101-10-S

Connector Accessories IDC Strain Relief Straight Glass Filled Polyester Black
Stock : 0

B3314151 electronic component of OKW B3314151

SEALING KIT, NET-BOX 140 ENCLOSURE
Stock : 0

EFM542-M290I* electronic component of Teledyne EFM542-M290I*

EFM542M290I teledyne
Stock : 1

BC857QAS electronic component of NXP BC857QAS

TRANS, DUAL PNP, AECQ101, -45V, DFN1010B
Stock : 0

MC703.70BP12VDC electronic component of IVO MC703.70BP12VDC

COUNTER, PCB, 12VDC
Stock : 0

MT1B electronic component of Apex Tool Group MT1B

Soldering Irons TIP,CONE SHAPE,1/8" FOR SP23/25,BULK
Stock : 0

MC6A-7/0.2T2-YW-100 electronic component of Pro Power MC6A-7/0.2T2-YW-100

EQUIPMENT WIRE, 0.22MM2, YELLOW, 100M
Stock : 0

MC6A-7/0.2T2-RD-100 electronic component of Pro Power MC6A-7/0.2T2-RD-100

EQUIPMENT WIRE, 0.22MM22,RED, 100M
Stock : 0

FSM1JELGTR electronic component of TE Connectivity FSM1JELGTR

SWITCH TACTILE SPST-NO 0.05A 12V
Stock : 0

16GB (x72, ECC, DR) 204-Pin DDR3L SODIMM Features 1.35V DDR3L SDRAM SODIMM MT18KSF2G72HZ 16GB Figure 1: 204-Pin SODIMM (MO-268 R/C D1) Features DDR3L functionality and operations supported as Module Height: 30mm (1.181in) defined in the component data sheet 204-pin, small outline dual in-line memory module (SODIMM) with ECC Fast data transfer rates: PC3-14900, PC3-12800 16GB (2 Gig x 72) V = 1.35V (1.2831.45V) DD V = 1.5V (1.4251.575V) DD Backward compatible to V = 1.5V 0.075V DD V = 3.03.6V DDSPD Supports ECC error detection and correction Options Marking Nominal and dynamic on-die termination (ODT) for Operating temperature data, strobe, and mask signals Commercial (0C T 70C) None A Dual-rank Package 2 On-board I C temperature sensor with integrated 204-pin DIMM (halogen-free) Z serial presence-detect (SPD) EEPROM Frequency/CAS latency 1.07ns CL = 13 (DDR3-1866) -1G9 Fixed burst chop (BC) of 4 and burst length (BL) of 8 1.25ns CL = 11 (DDR3-1600) -1G6 via the mode register set (MRS) Selectable BC4 or BL8 on-the-fly (OTF) Gold edge contacts Halogen-free Fly-by topology Terminated control, command, and address bus Table 1: Key Timing Parameters Data Rate (MT/s) t t t Speed Industry CL = CL = CL = RCD RP RC Grade Nomenclature 13 11 10 CL = 9 CL = 8 CL = 7 CL = 6 CL = 5 (ns) (ns) (ns) -1G9 PC3-14900 1866 1600 1333 1333 1066 1066 800 667 13.125 13.125 47.125 -1G6 PC3-12800 1600 1333 1333 1066 1066 800 667 13.125 13.125 48.125 -1G4 PC3-10600 1333 1333 1066 1066 800 667 13.125 13.125 49.125 -1G1 PC3-8500 1066 1066 800 667 13.125 13.125 50.625 -1G0 PC3-8500 1066 800 667 15 15 52.5 -80B PC3-6400 800 667 15 15 52.5 PDF: 09005aef861a851f Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 ksf18c2gx72hz.pdf Rev. B 4/15 EN 2015 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.16GB (x72, ECC, DR) 204-Pin DDR3L SODIMM Features Table 2: Addressing Parameter 16GB Refresh count 8K Row address 64K A 15:0 Device bank address 8 BA 2:0 Device configuration 8Gb (1 Gig x 8) Column address 2K A 11, 9:0 Module rank address 2 S 1:0 Table 3: Part Numbers and Timing Parameters 8GB Modules 1 Base device: MT41K1G8, 8Gb 1.35V DDR3L SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT18KSF2G72HZ-1G9 16GB 2 Gig x 72 14.9 GB/s 1.07ns/1866MT/s 13-13-13 MT18KSF2G72HZ-1G6 16GB 2 Gig x 72 12.8 GB/s 1.25ns/1600 MT/s 11-11-11 Notes: 1. The data sheet for the base device can be found on Microns web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Con- sult factory for current revision codes. Example: MT18KSF2G72HZ-1G9A2. PDF: 09005aef861a851f Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 ksf18c2gx72hz.pdf Rev. B 4/15 EN 2015 Micron Technology, Inc. All rights reserved.

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

8542.32.00 33 No ..Memory cards (other than ""smart"" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)
EL9
Elpida Memory
ELPIDA MEMORY INC
IE6
MI9
MICRON SEMICONDUCTOR
Micron Tech
MICRON TECHNOLOGY
Micron Technology Inc
Micron Technology Inc.
NU9
Numonyx - A DIVISION OF MICRON SEMICONDUCTOR PRODUCTS, INC. (VA)

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted