X-On Electronics has gained recognition as a prominent supplier of MT8HTF12864AZ-1GAH1 memory modules across the USA, India, Europe, Australia, and various other global locations. MT8HTF12864AZ-1GAH1 memory modules are a product manufactured by Micron. We provide cost-effective solutions for memory modules, ensuring timely deliveries around the world.

MT8HTF12864AZ-1GAH1

MT8HTF12864AZ-1GAH1 electronic component of Micron
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See Product Specifications
Part No.MT8HTF12864AZ-1GAH1
Manufacturer: Micron
Category:Memory Modules
Description: DRAM Module DDR2 SDRAM 1Gbyte 240UDIMM
Datasheet: MT8HTF12864AZ-1GAH1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 20.6737 ea
Line Total: USD 20.67

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 30 May to Wed. 05 Jun

MOQ : 1
Multiples : 1
1 : USD 20.6737
25 : USD 12.5655
100 : USD 9.4241
500 : USD 7.5393
1000 : USD 6.7315

0 - WHS 2


Ships to you between Thu. 30 May to Wed. 05 Jun

MOQ : 1
Multiples : 1
1 : USD 57.4048
25 : USD 34.9029
100 : USD 26.1743
500 : USD 20.9462
1000 : USD 18.7024

     
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We proudly offer the MT8HTF12864AZ-1GAH1 Memory Modules at competitive prices in the United States, Australia, India, Europe and more. By maintaining strong relationships with manufacturers and optimizing our operations, we provide significant savings to our customers. Customer satisfaction is at the heart of our business. Our knowledgeable and friendly customer service team is always ready to assist you with any inquiries or issues. From product selection to after-sales support, we are dedicated to providing our customers with a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why we are the top choice for the MT8HTF12864AZ-1GAH1 Memory Modules.

512MB, 1GB, 2GB (x64, SR) 240-Pin DDR2 UDIMM Features DDR2 SDRAM UDIMM MT8HTF6464AZ 512MB MT8HTF12864AZ 1GB MT8HTF25664AZ 2GB Figure 1: 240-Pin UDIMM (MO-237 R/C D) Features Module height: 30mm (1.181 in) 240-pin, unbuffered dual in-line memory module * Fast data transfer rates: PC2-3200, PC2-4200, PC2-5300, PC2-6400, or PC2-8500 512MB (54 Meg x 64), 1GB (128 Meg x 64), or 2GB (256 Meg x 64) Alternate EEPROM Placement * V = V = 1.8V DD DDQ V = 1.73.6V DDSPD Options Marking 1 JEDEC-standard 1.8V I/O (SSTL 18-compatible) Operating temperature Commercial (0C T +70C) None Differential data strobe (DQS, DQS ) option A Industrial (40C T +85C) I A 4n-bit prefetch architecture Package Multiple internal device banks for concurrent 240-pin DIMM (halogen-free) Z operation 2 Frequency/CL Programmable CAS latency (CL) 1.875ns CL = 7 (DDR2-1066) -1GA Posted CAS additive latency (AL) 2.5ns CL = 5 (DDR2-800) -80E t WRITE latency = READ latency - 1 CK 2.5ns CL = 6 (DDR2-800) -800 3.0ns CL = 5 (DDR2-667) -667 Programmable burst lengths (BL): 4 or 8 Adjustable data-output drive strength 1. Contact Micron for industrial temperature Notes: module offerings. 64ms, 8192-cycle refresh 2. CL = CAS (READ) latency. On-die termination (ODT) Serial presence detect (SPD) with EEPROM Halogen-free Gold edge contacts Single rank Table 1: Key Timing Parameters Data Rate (MT/s) t t t Speed Industry RCD RP RC Grade Nomenclature CL = 7 CL = 6 CL = 5 CL = 4 CL = 3 (ns) (ns) (ns) -1GA PC2-8500 1066 800 667 533 400 13.125 13.125 58.125 -80E PC2-6400 800 800 533 400 12.5 12.5 57.5 -800 PC2-6400 800 667 533 400 15 15 60 -667 PC2-5300 667 553 400 15 15 60 -53E PC2-4200 553 400 15 15 55 -40E PC2-3200 400 400 15 15 55 PDF: 09005aef83b94f21 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 htf8c64 128 256x64az.pdf - Rev. E 4/14 EN 2009 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.512MB, 1GB, 2GB (x64, SR) 240-Pin DDR2 UDIMM Features Table 2: Addressing Parameter 512MB 1GB 2GB Refresh count 8K 8K 8K Row address 16K A 13:0 16K A 13:0 32K A 14:0 Device bank address 4 BA 1:0 8 BA 2:0 8 BA 2:0 Device configuration 512MB (64 Meg x 8) 1Gb (128 Meg x 8) 2Gb (256 Meg x 8) Column address 1K A 9:0 1K A 9:0 1K A 9:0 Module rank address 1 S0 1 S0 1 S0 Table 3: Part Numbers and Timing Parameters 512MB 1 Base device: MT47H64M8, 512Mb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT8HTF6464A(I)Z-80E 512MB 64 Meg x 64 6.2 GB/s 2.5ns/800 MT/s 5-5-5 MT8HTF6464A(I)Z-800 512MB 64 Meg x 64 6.2 GB/s 2.5ns/800 MT/s 6-6-6 MT8HTF6464A(I)Z-667 512MB 64 Meg x 64 5.3 GB/s 3.0ns/667 MT/s 5-5-5 Table 4: Part Numbers and Timing Parameters 1GB 1 Base device: MT47H128M8, 1Gb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT8HTF12864A(I)Z-1GA 1GB 128 Meg x 64 8.5 GB/s 1.875ns/1066 MT/s 7-7-7 MT8HTF12864A(I)Z-80E 1GB 128 Meg x 64 6.2 GB/s 2.5ns/800 MT/s 5-5-5 MT8HTF12864A(I)Z-800 1GB 128 Meg x 64 6.2 GB/s 2.5ns/800 MT/s 6-6-6 MT8HTF12864A(I)Z-667 1GB 128 Meg x 64 5.3 GB/s 3.0ns/667 MT/s 5-5-5 Table 5: Part Numbers and Timing Parameters 2GB 1 Base device: MT47H256M8, 2Gb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT8HTF25664A(I)Z-1GA 2GB 256 Meg x 64 8.5 GB/s 1.875ns/1066 MT/s 7-7-7 MT8HTF25664A(I)Z-80E 2GB 256 Meg x 64 6.2 GB/s 2.5ns/800 MT/s 5-5-5 MT8HTF25664A(I)Z-800 2GB 256 Meg x 64 6.2 GB/s 2.5ns/800 MT/s 6-6-6 MT8HTF25664A(I)Z-667 2GB 256 Meg x 64 5.3 GB/s 3.0ns/667 MT/s 5-5-5 Notes: 1. The data sheet for the base device can be found on Microns Web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT8HTF12864AZ-800M1. PDF: 09005aef83b94f21 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 htf8c64 128 256x64az.pdf - Rev. E 4/14 EN 2009 Micron Technology, Inc. All rights reserved.

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

8542.32.00 33 No ..Memory cards (other than ""smart"" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)
EL9
Elpida Memory
ELPIDA MEMORY INC
IE6
MI9
MICRON SEMICONDUCTOR
Micron Tech
MICRON TECHNOLOGY
Micron Technology Inc
Micron Technology Inc.
NU9
Numonyx - A DIVISION OF MICRON SEMICONDUCTOR PRODUCTS, INC. (VA)

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