74AUP1G175GW

74AUP1G175 Low-power D-type flip-flop with reset positive-edge trigger Rev. 5 3 July 2012 Product data sheet 1. General description The 74AUP1G175 provides a low-power, low-voltage positive-edge triggered D-type flip-flop with individual data (D) input, clock (CP) input, master reset (MR) input, and Q output. The master reset (MR) is an asynchronous active LOW input and operates independently of the clock input. Information on the data input is transferred to the Q output on the LOW-to-HIGH transition of the clock pulse. The D input must be stable one set-up time prior to the LOW-to-HIGH clock transition, for predictable operation. Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire V range from 0.8 V to 3.6 V. This device ensures a very low CC static and dynamic power consumption across the entire V range from 0.8 V to 3.6 V. CC This device is fully specified for partial power-down applications using I . OFF The I circuitry disables the output, preventing the damaging backflow current through OFF the device when it is powered down. 2. Features and benefits Wide supply voltage range from 0.8 V to 3.6 V High noise immunity Complies with JEDEC standards: JESD8-12 (0.8 V to 1.3 V) JESD8-11 (0.9 V to 1.65 V) JESD8-7 (1.2 V to 1.95 V) JESD8-5 (1.8 V to 2.7 V) JESD8-B (2.7 V to 3.6 V) ESD protection: HBM JESD22-A114F Class 3A exceeds 5000 V MM JESD22-A115-A exceeds 200 V CDM JESD22-C101E exceeds 1000 V Low static power consumption I = 0.9 A (maximum) CC Latch-up performance exceeds 100 mA per JESD 78 Class II Inputs accept voltages up to 3.6 V Low noise overshoot and undershoot < 10 % of V CC I circuitry provides partial Power-down mode operation OFF Multiple package options Specified from 40 Cto+85 C and 40 Cto+125 C74AUP1G175 NXP Semiconductors Low-power D-type flip-flop with reset positive-edge trigger 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74AUP1G175GW 40 C to +125 C SC-88 plastic surface-mounted package 6 leads SOT363 74AUP1G175GM 40 C to +125 C XSON6 plastic extremely thin small outline package no leads SOT886 6 terminals body 1 1.45 0.5 mm 74AUP1G175GF 40 C to +125 C XSON6 plastic extremely thin small outline package no leads SOT891 6 terminals body 1 1 0.5 mm 74AUP1G175GN 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1115 6 terminals body 0.9 1.0 0.35 mm 74AUP1G175GS 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1202 6 terminals body 1.0 1.0 0.35 mm 4. Marking Table 2. Marking 1 Type number Marking code 74AUP1G175GW aT 74AUP1G175GM aT 74AUP1G175GF aT 74AUP1G175GN aT 74AUP1G175GS aT 1 The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 6 MR 1 3 CP D 4 FF 3 4 Q DQ 1 CP 6 MR 001aaa468 001aaa469 Fig 1. Logic symbol Fig 2. IEC logic symbol 74AUP1G175 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 3 July 2012 2 of 23