BAV199,235

BAV199 Low-leakage double diode 1 September 2020 Product data sheet 1. General description Epitaxial, medium-speed switching, double diode in a small SOT23 plastic SMD package. The diodes are connected in series. 2. Features and benefits Plastic SMD package Low leakage current: typ. 3 pA Switching time: typ. 0.8 us Continuous reverse voltage: max. 75 V Repetitive peak reverse voltage: max. 85 V Repetitive peak forward current: max. 500 mA. AEC-Q101 qualified 3. Applications Low-leakage current applications in surface mounted circuits. 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per diode V reverse voltage - - 75 V R I reverse current V = 75 V T = 150 C - 3 80 nA R R j 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 3 K1, A2 1 A1 anode (diode 1) 2 K2 cathode (diode 2) 3 K1, A2 cathode (diode 1) and anode (diode 2) 1 2 A1 K2 006aaa763 SOT23Nexperia BAV199 Low-leakage double diode 6. Ordering information Table 3. Ordering information Type number Package Name Description Version BAV199 SOT23 plastic, surface-mounted package 3 terminals 1.9 mm pitch 2.9 SOT23 mm x 1.3 mm x 1 mm body 7. Marking Table 4. Marking codes Type number Marking code 1 BAV199 JY% 1 % = placeholder for manufacturing site code 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode V reverse voltage - 75 V R V repetitive peak reverse - 85 V RRM voltage I forward current single diode loaded - 160 mA F double diode loaded - 140 mA I repetitive peak forward - 500 mA FRM current I non-repetitive peak t = 1 s square wave T = 25 C - 4 A FSM p j(init) forward current t = 1 ms square wave T = 25 C - 1 A p j(init) t = 1 s square wave T = 25 C - 0.5 A p j(init) Per device one diode loaded P total power dissipation T 25 C 1 - 250 mW tot amb T junction temperature - 150 C j T ambient temperature -65 150 C amb T storage temperature -65 150 C stg 1 Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. BAV199 All information provided in this document is subject to legal disclaimers. Nexperia B.V. 2020. All rights reserved Product data sheet 1 September 2020 2 / 10