AN11689 Recommendations for PCB assembly of DSN1006 Rev. 1 29 July 2015 Application note Document information Info Content Keywords DSN1006, DSN1006-2, DSN1006U-2, SOD993, SOD995, 0402 package size, reflow soldering, surface mount, solder paste, stencil aperture, Printed-Circuit Board (PCB), Solder Mask Defined (SMD), footprint, landing pattern, pick and place, Chip-Scale Package (CSP) Abstract This application note provides guidelines for board assembly of the 2 ultra-small DSN1006 (1.0 0.6 mm ) chip-scale package. The main focus is on recommendations for reflow soldering. For general information about footprint design and reflow soldering see application note AN10365 (Surface mount reflow soldering description).AN11689 NXP Semiconductors Recommendations for PCB assembly of DSN1006 Revision history Rev Date Description 1 20150729 Initial version Contact information For more information, please visit: