74HC75N,652 NXP

74HC75 Quad bistable transparant latch Rev. 03 12 November 2004 Product data sheet 1. General description The 74HC75 is a high-speed Si-gate CMOS device and is pin compatible with low power Schottky TTL (LSTTL). The 74HC75 is specied in compliance with JEDEC standard no. 7A. The 74HC75 has four bistable latches. The two latches are simultaneously controlled by one of two active HIGH enable inputs (LE12 and LE34). When LEnn is HIGH, the data enters the latches and appears at the nQ outputs. The nQ outputs follow the data inputs (nD) as long as LEnn is HIGH (transparent). The data on the nD inputs one set-up time prior to the HIGH-to-LOW transition of the LEnn will be stored in the latches. The latched outputs remain stable as long as the LEnn is LOW. 2. Features Complementary Q and Q outputs V and GND on the center pins CC Low-power dissipation Complies with JEDEC standard no. 7A ESD protection: HBM EIA/JESD22-A114-B exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. Multiple package options Specied from - 40 Cto+80 C and from - 40 C to +125 C.74HC75 Philips Semiconductors Quad bistable transparant latch 3. Quick reference data Table 1: Quick reference data Symbol Parameter Conditions Min Typ Max Unit t , t propagation delay C =15pF PHL PLH L V =5V CC nD to nQ, nQ - 11 - ns LEnn to nQ, nQ - 11 - ns C input capacitance - 3.5 - pF I 1 C power dissipation V = GND to V -42 - pF PD I CC capacitance per latch 1 C is used to determine the dynamic power dissipation (P in W). PD D 2 2 P =C V f N+ (C V f ) where: D PD CC i L CC o f = input frequency in MHz i f = output frequency in MHz o C = output load capacitance in pF L V = supply voltage in V CC N = number of inputs switching 2 (C V f ) = sum of outputs. L CC o 4. Ordering information Table 2: Ordering information Type number Package Temperature range Name Description Version 74HC75N - 40 C to +125 C DIP16 plastic dual in-line package 16 leads (300 mil) SOT38-4 74HC75D - 40 C to +125 C SO16 plastic small outline package 16 leads SOT109-1 body width 3.9 mm 74HC75DB - 40 C to +125 C SSOP16 plastic shrink small outline package 16 leads SOT338-1 body width 5.3 mm 74HC75PW - 40 C to +125 C TSSOP16 plastic thin shrink small outline package SOT403-1 16 leads body width 4.4 mm 9397 750 13816 Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 03 12 November 2004 2 of 20