X-On Electronics has gained recognition as a prominent supplier of BGA2870,115 RF Amplifier across the USA, India, Europe, Australia, and various other global locations. BGA2870,115 RF Amplifier are a product manufactured by NXP. We provide cost-effective solutions for RF Amplifier, ensuring timely deliveries around the world.

BGA2870,115 NXP

BGA2870,115 electronic component of NXP
BGA2870,115 NXP
BGA2870,115 RF Amplifier
BGA2870,115  Semiconductors

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See Product Specifications
Part No. BGA2870,115
Manufacturer: NXP
Category: RF Amplifier
Description: RF Amplifier MMIC wideband amp
Datasheet: BGA2870,115 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.4325 ea
Line Total: USD 0.43 
Availability - 4365
Ship by Wed. 25 Jun to Fri. 27 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4365
Ship by Wed. 25 Jun to Fri. 27 Jun
MOQ : 1
Multiples : 1
1 : USD 0.4325
10 : USD 0.38
25 : USD 0.3504
100 : USD 0.3105
250 : USD 0.275
1000 : USD 0.2651
3000 : USD 0.2123
9000 : USD 0.2123
18000 : USD 0.2079

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Type
Operating Frequency
P1dB - Compression Point
Gain
Operating Supply Voltage
NF - Noise Figure
OIP3 - Third Order Intercept
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Operating Supply Current
Packaging
Test Frequency
Bandwidth
Brand
Isolation Db
Product Type
Factory Pack Quantity :
Subcategory
Supply Voltage - Max
Supply Voltage - Min
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We are delighted to provide the BGA2870,115 from our RF Amplifier category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BGA2870,115 and other electronic components in the RF Amplifier category and beyond.

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BGA2870 MMIC wideband amplifier Rev. 3 13 July 2015 Product data sheet 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 plastic SMD package. 1.2 Features and benefits Internally matched to 50 A gain of 31.1 dB at 500 MHz Output power at 1 dB gain compression = 4 dBm Supply current = 16.0 mA at a supply voltage of 2.5 V Reverse isolation > 52 dB up to 750 MHz Good linearity with low second order and third order products Noise figure = 3.2 dB at 500 MHz Unconditionally stable (K > 1) No output inductor required 1.3 Applications LNB IF amplifiers General purpose low noise wideband amplifier for frequencies between DC and 750 MHz 2. Pinning information Table 1. Pinning Pin Description Simplified outline Graphic symbol 1V CC 6 5 4 1 2, 5 GND2 6 3 3RF OUT 4 GND1 4 2, 5 132 6RF IN sym052BGA2870 NXP Semiconductors MMIC wideband amplifier 3. Ordering information Table 2. Ordering information Type number Package Name Description Version BGA2870 - plastic surface-mounted package 6 leads SOT363 4. Marking Table 3. Marking Type number Marking code Description BGA2870 YC* * = - : made in Hong Kong * = p : made in Hong Kong * = W : made in China * = t : made in Malaysia 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V supply voltage RF input AC coupled 0.5 3.6 V CC I supply current - 55 mA CC P total power dissipation T = 90 C-200mW tot sp T storage temperature 40 +125 C stg T junction temperature - 125 C j P drive power - +10 dBm drive 6. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction to P = 200 mW T =90 C 300 K/W th(j-sp) tot sp solder point 7. Characteristics Table 6. Characteristics V = 2.5 V Z = Z = 50 P = 30 dBm T = 25 C measured on demo board unless otherwise specified. CC S L i amb Symbol Parameter Conditions Min Typ Max Unit V supply voltage 2.3 2.5 2.7 V CC I supply current 13.5 16.0 17.1 mA CC BGA2870 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 3 13 July 2015 2 of 18

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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