BUJ302AX NXP

BUJ302AX NPN power transistor Rev. 02 28 March 2011 Product data sheet 1. Product profile 1.1 General description High-voltage, high-speed planar-passivated NPN power switching transistor in a SOT186A (TO-220F) plastic package. 1.2 Features and benefits Fast switching Isolated package High voltage capability Low thermal resistance 1.3 Applications DC-to-DC converters Inverters High-frequency electronic lighting Motor control systems ballast applications 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit I collector current see Figure 1 see Figure 2 --4 A C see Figure 4 P total power T 25 C see Figure 3 --26 W tot h dissipation V collector-emitter V=0V --1050V CESM BE peak voltage Static characteristics h DC current gain I =0.1 A V =5V T =25C 48 66 100 FE C CE h see Figure 11 I =0.8 A V =3V T =25C 25 42 50 C CE h see Figure 12 TO-220FBUJ302AX NXP Semiconductors NPN power transistor 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 B base mb C 2 C collector 3E emitter B mb n.c. isolated E sym123 1 2 3 SOT186A (TO-220F) 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BUJ302AX TO-220F plastic single-ended package isolated heatsink mounted SOT186A 1 mounting hole 3-lead TO-220full pac 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V collector-emitter peak voltage V = 0 V - 1050 V CESM BE V collector-emitter voltage I = 0 A - 400 V CEO B I collector current see Figure 1 see Figure 2 see Figure 4 -4 A C I peak collector current - 8 A CM I base current DC - 2 A B I peak base current - 4 A BM P total power dissipation T 25 C see Figure 3 -26 W tot h T storage temperature -65 150 C stg T junction temperature - 150 C j V emitter-base voltage I =0A I =2A t < 10 ms - 24 V EBO C E p BUJ302AX All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 02 28 March 2011 2 of 13