Product Information

MC9S08PL4CTJ

MC9S08PL4CTJ electronic component of NXP

Datasheet
8-bit Microcontrollers - MCU 5V 8-bit S08PL MCU 4KB FL,512B RAM

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.61 ea
Line Total: USD 1.61

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Warehouse 1


Ships to you between Mon. 06 May to Fri. 10 May

MOQ : 75
Multiples : 75
75 : USD 0.9814
150 : USD 0.945
300 : USD 0.945
375 : USD 0.945
1125 : USD 0.9086

0 - Warehouse 2


Ships to you between Fri. 10 May to Tue. 14 May

MOQ : 2250
Multiples : 2250
2250 : USD 1.0718
4500 : USD 1.0546
6750 : USD 1.035
11250 : USD 1.0143
27000 : USD 1.0051

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Core
Data Bus Width
Maximum Clock Frequency
Program Memory Size
Data RAM Size
Operating Supply Voltage
Maximum Operating Temperature
Package / Case
Mounting Style
Product
Program Memory Type
Series
Brand
Data Ram Type
Data Rom Size
Data Rom Type
Interface Type
Number Of I/Os
Adc Resolution
Minimum Operating Temperature
Number Of Adc Channels
Product Type
Factory Pack Quantity :
Subcategory
Supply Voltage - Max
Supply Voltage - Min
Watchdog Timers
Cnhts
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Document Number MC9S08PL4 NXP Semiconductors Rev. 3, 08/2019 Data Sheet: Technical Data MC9S08PL4 MC9S08PL4 Series Data Sheet Supports: MC9S08PL4 Key features Development support Single-wire background debug interface 8-Bit S08 central processor unit (CPU) Breakpoint capability to allow three breakpoints Up to 20 MHz bus at 2.7 V to 5.5 V across setting during in-circuit debugging temperature range of -40 C to 85 C On-chip in-circuit emulator (ICE) debug module Supporting up to 40 interrupt/reset sources containing two comparators and nine trigger modes Supporting up to four-level nested interrupt On-chip memory Peripherals Up to 4 KB flash read/program/erase over full ACMP - one analog comparator with both positive operating voltage and temperature and negative inputs separately selectable interrupt Up to 128 byte EEPROM 2-byte erase sector on rising and falling comparator output filtering program and erase while executing flash ADC - 8-channel, 10-bit resolution 2.5 s Up to 512 byte random-access memory (RAM) conversion time data buffers with optional Flash and RAM access protection watermark automatic compare function internal bandgap reference channel operation in stop mode Power-saving modes optional hardware trigger One low-power stop mode reduced power wait FTM - two 2-channel flex timer modulators mode modules 16-bit counter each channel can be Peripheral clock enable register can disable clocks to configured for input capture, output compare, edge- unused modules, reducing currents allows clocks to or center-aligned PWM mode remain enabled to specific peripherals in stop3 mode RTC - 16-bit real timer counter (RTC) Clocks SCI - one serial communication interface (SCI/ Oscillator (XOSC) - loop-controlled Pierce UART) modules optional 13-bit break full duplex oscillator crystal or ceramic resonator range of non-return to zero (NRZ) LIN extension support 31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz Input/Output Internal clock source (ICS) - containing a frequency- Up to 18 GPIOs including one output-only pin locked-loop (FLL) controlled by internal or external One 8-bit keyboard interrupt module (KBI) reference precision trimming of internal reference allowing 1% deviation across temperature range of 0 Package options C to 70 C and 2% deviation across whole 20-pin TSSOP operating temperature range up to 20 MHz 16-pin TSSOP 8-pin SOIC System protection Watchdog with independent clock source Low-voltage detection with reset or interrupt selectable trip points Illegal opcode detection with reset Illegal address detection with reset NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 MCU block diagram...........................................................................3 6.2.1 Control timing..............................................................13 2 Orderable part numbers......................................................................4 6.2.2 Debug trace timing specifications................................14 3 Part identification...............................................................................4 6.2.3 FTM module timing.....................................................15 3.1 Description.................................................................................4 6.3 Thermal specifications...............................................................16 3.2 Format........................................................................................4 6.3.1 Thermal operating requirements.................................. 16 3.3 Fields..........................................................................................5 6.3.2 Thermal characteristics................................................ 16 3.4 Example..................................................................................... 5 7 Peripheral operating requirements and behaviors..............................17 4 Parameter Classification.....................................................................5 7.1 External oscillator (XOSC) and ICS characteristics..................17 5 Ratings................................................................................................6 7.2 NVM specifications...................................................................19 5.1 Thermal handling ratings...........................................................6 7.3 Analog........................................................................................20 5.2 Moisture handling ratings..........................................................6 7.3.1 ADC characteristics..................................................... 20 5.3 ESD handling ratings.................................................................6 7.3.2 Analog comparator (ACMP) electricals...................... 23 5.4 Voltage and current operating ratings........................................6 8 Dimensions.........................................................................................23 6 General............................................................................................... 7 8.1 Obtaining package dimensions..................................................23 6.1 Nonswitching electrical specifications...................................... 7 9 Pinout................................................................................................. 24 6.1.1 DC characteristics........................................................ 7 9.1 Signal multiplexing and pin assignments.................................. 24 6.1.2 Supply current characteristics...................................... 12 9.2 Device pin assignment...............................................................25 6.1.3 EMC performance........................................................13 10 Revision history................................................................................. 26 6.2 Switching specifications............................................................ 13 MC9S08PL4 Series Data Sheet, Rev. 3, 08/2019 2 NXP Semiconductors

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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