X-On Electronics has gained recognition as a prominent supplier of MPXC2011DT1 board mount pressure sensors across the USA, India, Europe, Australia, and various other global locations. MPXC2011DT1 board mount pressure sensors are a product manufactured by NXP. We provide cost-effective solutions for board mount pressure sensors, ensuring timely deliveries around the world.

MPXC2011DT1 NXP

MPXC2011DT1 electronic component of NXP
Images are for reference only
See Product Specifications
Part No.MPXC2011DT1
Manufacturer: NXP
Category:Board Mount Pressure Sensors
Description: Pressure Sensor 1.45PSI (10kPa) Differential 0 mV ~ 25 mV (10V) 4-SSIP Module
Datasheet: MPXC2011DT1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 8.2613 ea
Line Total: USD 8.26

Availability - 0
  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 18 Jun to Mon. 24 Jun

MOQ : 1000
Multiples : 1000
1000 : USD 11.781

0 - WHS 2


Ships to you between Tue. 18 Jun to Mon. 24 Jun


Multiples : 1

0 - WHS 3


Ships to you between Mon. 24 Jun to Wed. 26 Jun

MOQ : 1
Multiples : 1
1 : USD 18.7706
10 : USD 14.8907
25 : USD 14.1076
100 : USD 12.0431
250 : USD 11.6041
500 : USD 11.4498
1000 : USD 10.9752
5000 : USD 10.5836

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Operating Pressure
Pressure Type
Mounting Style
Operating Supply Voltage
Package / Case
Packaging
Series
Brand
Maximum Operating Temperature
Minimum Operating Temperature
Factory Pack Quantity :
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We are delighted to provide the MPXC2011DT1 from our Board Mount Pressure Sensors category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MPXC2011DT1 and other electronic components in the Board Mount Pressure Sensors category and beyond.

Freescale Semiconductor Document Number: MPXC2011DT1 Data Sheet: Technical Data Rev. 11, 09/2015 MPXC2011DT1, 0 to 10 kPa, MPXC2011DT1 Differential, Compensated Pressure Sensor Freescale Semiconductor has developed a high volume, miniature pressure Chip Pak package sensor package which is ideal as a sub-module component or a disposable unit. Back view The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor s unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration. Features Integrated temperature compensation and calibration MPXC2011DT1 Ratiometric to supply voltage Case 98ASB13355C Polysulfone case material (ISO 10993) Provided in easy-to-use tape and reel Front view Typical applications Respiratory diagnostics Air movement control Controllers Pressure switching 12 3 4 NOTE The die and wire bonds are exposed on the front side of the chip pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer s Pinout housing. Use caution when handling the devices during all processes. Ordering Information Pressure Type Device Name Shipping Package Device Marking Gauge Differential Absolute XXXX = Device code MPXC2011DTI Tape and Reel 98ASB13355C XXX = Trace code Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2010, 2012, 2014, 2015 Freescale Semiconductor, Inc. All rights reserved. GND +V OUT +V S V OUTContents 1 General Description 3 1.1 Block diagram . 3 1.2 Pinout . 3 2 Mechanical and Electrical Specifications . 4 2.1 Maximum ratings . 4 2.2 Operating characteristics 4 3 Package Dimensions . 5 3.1 Package description 5 4 Revision History . 6 Related Documentation The MPXC2011DT1 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at:

Tariff Desc

8542.31.20 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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