X-On Electronics has gained recognition as a prominent supplier of SPC5643LFF2MLQ1 32-bit Microcontrollers - MCU across the USA, India, Europe, Australia, and various other global locations. SPC5643LFF2MLQ1 32-bit Microcontrollers - MCU are a product manufactured by NXP. We provide cost-effective solutions for 32-bit Microcontrollers - MCU, ensuring timely deliveries around the world.

SPC5643LFF2MLQ1 NXP

SPC5643LFF2MLQ1 electronic component of NXP
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Part No.SPC5643LFF2MLQ1
Manufacturer: NXP
Category: 32-bit Microcontrollers - MCU
Description: 32-bit Microcontrollers - MCU 32B 1M FLASH 128KRAM
Datasheet: SPC5643LFF2MLQ1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 29.0375 ea
Line Total: USD 29.04 
Availability - 363
Ship by Thu. 21 Nov to Mon. 25 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2
Ship by Fri. 22 Nov to Wed. 27 Nov
MOQ : 1
Multiples : 1
1 : USD 53.3204
10 : USD 46.1901
30 : USD 41.8412
100 : USD 38.1996

363
Ship by Thu. 21 Nov to Mon. 25 Nov
MOQ : 1
Multiples : 1
1 : USD 29.0375
10 : USD 23.667
120 : USD 23.667

   
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Freescale Semiconductor Document Number: MPC5643L Rev. 9, 6/2013 Data Sheet: Advance Information MPC5643L MAPBGA225 QFN12 15 mm x 15 mm mm x mm SOT-343R PKG-TBD Qorivva MPC5643L mm x mm mm x mm TBD 144 LQFP 257 MAPBGA Microcontroller Data Sheet (20 x 20 x 1.4 mm) (14 x 14 x 0.8 mm) Cyclic redundancy check (CRC) unit High-performance e200z4d dual core Decoupled Parallel mode for high-performance use of 32-bit Power Architecture technology CPU replicated cores Core frequency as high as 120 MHz Nexus Class 3+ interface Dual issue five-stage pipeline core Interrupts Variable Length Encoding (VLE) Replicated 16-priority controller Memory Management Unit (MMU) Replicated 16-channel eDMA controller 4 KB instruction cache with error detection code GPIOs individually programmable as input, output or Signal processing engine (SPE) special function Memory available Three 6-channel general-purpose eTimer units 1 MB flash memory with ECC 2 FlexPWM units 128 KB on-chip SRAM with ECC Four 16-bit channels per module Built-in RWW capabilities for EEPROM emulation Communications interfaces SIL3/ASILD innovative safety concept: LockStep mode and 2 LINFlexD channels Fail-safe protection 3 DSPI channels with automatic chip select Sphere of replication (SoR) for key components (such as generation CPU core, eDMA, crossbar switch) 2 FlexCAN interfaces (2.0B Active) with 32 Fault collection and control unit (FCCU) message objects Redundancy control and checker unit (RCCU) on outputs FlexRay module (V2.1 Rev. A) with 2 channels, of the SoR connected to FCCU 64 message buffers and data rates up to 10 Mbit/s Boot-time Built-In Self-Test for Memory (MBIST) and Two 12-bit analog-to-digital converters (ADCs) Logic (LBIST) triggered by hardware 16 input channels Boot-time Built-In Self-Test for ADC and flash memory Programmable cross triggering unit (CTU) to triggered by software synchronize ADCs conversion with timer and Replicated safety enhanced watchdog PWM Replicated junction temperature sensor Sine wave generator (D/A with low pass filter) Non-maskable interrupt (NMI) On-chip CAN/UART bootstrap loader 16-region memory protection unit (MPU) Single 3.0 V to 3.6 V voltage supply Clock monitoring units (CMU) Ambient temperature range 40 C to 125 C Power management unit (PMU) Junction temperature range 40 C to 150 C This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. Freescale Semiconductor, Inc., 20092013. All rights reserved.Table of Contents 1 Introduction 3 1.5.40 Voltage regulator / Power Management Unit 1.1 Document overview 3 (PMU) . 22 1.2 Description .3 1.5.41 Built-In Self-Test (BIST) capability 22 1.3 Device comparison .3 2 Package pinouts and signal descriptions . 23 1.4 Block diagram .5 2.1 Package pinouts . 23 1.5 Feature details 7 2.2 Supply pins . 52 1.5.1 High-performance e200z4d core .7 2.3 System pins . 54 1.5.2 Crossbar switch (XBAR) .8 2.4 Pin muxing 55 1.5.3 Memory Protection Unit (MPU) 8 3 Electrical characteristics 76 1.5.4 Enhanced Direct Memory Access (eDMA) .8 3.1 Introduction . 76 1.5.5 On-chip flash memory with ECC .9 3.2 Absolute maximum ratings . 76 1.5.6 On-chip SRAM with ECC .9 3.3 Recommended operating conditions 77 1.5.7 Platform flash memory controller .9 3.4 Thermal characteristics 78 1.5.8 Platform Static RAM Controller (SRAMC) .10 3.4.1 General notes for specifications at maximum 1.5.9 Memory subsystem access time 10 junction temperature 80 1.5.10 Error Correction Status Module (ECSM) 11 3.5 Electromagnetic Interference (EMI) characteristics . 81 1.5.11 Peripheral bridge (PBRIDGE) 11 3.6 Electrostatic discharge (ESD) characteristics . 82 1.5.12 Interrupt Controller (INTC) .11 3.7 Static latch-up (LU) . 83 1.5.13 System clocks and clock generation .12 3.8 Voltage regulator electrical characteristics . 83 1.5.14 Frequency-Modulated Phase-Locked Loop 3.9 DC electrical characteristics 86 (FMPLL) 12 3.10 Supply current characteristics . 87 1.5.15 Main oscillator 13 3.11 Temperature sensor electrical characteristics . 90 1.5.16 Internal Reference Clock (RC) oscillator 13 3.12 Main oscillator electrical characteristics . 90 1.5.17 Clock, reset, power, mode and test control 3.13 FMPLL electrical characteristics . 92 modules (MC CGM, MC RGM, MC PCU, and MC ME) 3.14 16 MHz RC oscillator electrical characteristics 94 13 3.15 ADC electrical characteristics . 94 1.5.18 Periodic Interrupt Timer Module (PIT) 13 3.15.1 Input Impedance and ADC Accuracy 94 1.5.19 System Timer Module (STM) .13 3.16 Flash memory electrical characteristics 99 1.5.20 Software Watchdog Timer (SWT) .14 3.17 SWG electrical characteristics 100 1.5.21 Fault Collection and Control Unit (FCCU) .14 3.18 AC specifications 101 1.5.22 System Integration Unit Lite (SIUL) 14 3.18.1 Pad AC specifications 101 1.5.23 Non-Maskable Interrupt (NMI) 14 3.19 Reset sequence . 102 1.5.24 Boot Assist Module (BAM) .14 3.19.1 Reset sequence duration 102 1.5.25 System Status and Configuration Module 3.19.2 Reset sequence description 102 (SSCM) .15 3.19.3 Reset sequence trigger mapping 105 1.5.26 FlexCAN 15 3.19.4 Reset sequence start condition . 106 1.5.27 FlexRay .16 3.19.5 External watchdog window . 107 1.5.28 Serial communication interface module 3.20 AC timing characteristics 107 (LINFlexD) .16 3.20.1 RESET pin characteristics . 108 1.5.29 Deserial Serial Peripheral Interface (DSPI) 17 3.20.2 WKUP/NMI timing . 109 1.5.30 FlexPWM 17 3.20.3 IEEE 1149.1 JTAG interface timing 109 1.5.31 eTimer module 18 3.20.4 Nexus timing 111 1.5.32 Sine Wave Generator (SWG) 19 3.20.5 External interrupt timing (IRQ pin) . 114 1.5.33 Analog-to-Digital Converter module (ADC) 19 3.20.6 DSPI timing 115 1.5.34 Cross Triggering Unit (CTU) .19 4 Package characteristics . 120 1.5.35 Cyclic Redundancy Checker (CRC) Unit 20 4.1 Package mechanical data . 120 1.5.36 Redundancy Control and Checker Unit (RCCU)20 5 Ordering information 125 1.5.37 Junction temperature sensor .20 6 Document revision history 126 1.5.38 Nexus Port Controller (NPC) .20 1.5.39 IEEE 1149.1 JTAG Controller (JTAGC) .21 MPC5643L Microcontroller Data Sheet, Rev. 9 2 Freescale Semiconductor

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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