ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. FDMA1032CZ 20V Complementary PowerTrench MOSFET FDMA1032CZ 20V Complementary PowerTrench MOSFET Features General Description x Q1: N-Channel 3.7 A, 20V. R = 68 m : V = 4.5V This device is designed specifically as a single package DS(ON) GS R = 86 m : V = 2.5V DS(ON) GS solution for a DC/DC Switching MOSFET in cellular x Q2: P-Channel handset and other ultra-portable applications. It 3.1 A, 20V. R = 95 m : V = 4.5V features an independent N-Channel & P-Channel DS(ON) GS R = 141 m : V = 2.5V DS(ON) GS MOSFET with low on-state resistance for minimum conduction losses. The gate charge of each MOSFET x Low profile 0.8 mm maximum in the new package is also minimized to allow high frequency switching MicroFET 2x2 mm directly from the controlling device. The MicroFET 2x2 HBM ESD protection level > 2 kV (Note 3) package offers exceptional thermal performance for its x RoHS Compliant physical size and is well suited to switching applications. Free from halogenated compounds and antimony oxides PIN 1 S1 G1 D2 1 6 D1 S1 D1 D2 2 5 G1 G2 3 4 D1 G2 S2 D2 S2 MicroFET 2x2 o Absolute Maximum Ratings T =25 C unless otherwise noted A Symbol Parameter Q1 Q2 Units V Drain-Source Voltage 20 20 V DS V Gate-Source Voltage 12r 12 V GS A Drain Current Continuous (Note 1a) 3.7 3.1 I D Pulsed 6 6 P Power Dissipation for Single Operation (Note 1a) 1.4 W D (Note 1b) 0.7 T , T Operating and Storage Junction Temperature Range 55 to +150 q C J STG Thermal Characteristics R Thermal Resistance, Junction-to-Ambient (Note 1a) 86 (Single Operation) T JA R Thermal Resistance, Junction-to-Ambient (Note 1b) 173 (Single Operation) T JA q C/W R Thermal Resistance, Junction-to-Ambient (Note 1c) 69 (Dual Operation) T JA Thermal Resistance, Junction-to-Ambient (Note 1d) 151 (Dual Operation) R T JA Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity 032 FDMA1032CZ 7 8mm 3000 units 2010 Semiconductor Components Industries, LLC. Publication Order Number: October-2017, Rev. 2 FDMA1032CZ/D