ZXMN10B08E6 100V N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features and Benefits Low On-Resistance Max I D BV Max R Fast Switching Speed DSS DS(on) T = +25C A (Note 6) Low Threshold 230m V = 10V 1.9A GS Low Gate Drive 100V 300m V = 4.5V 1.68A GS SOT26 Package Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Description and Applications Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability This MOSFET utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes it ideal for high-efficiency, low voltage, power management applications. Mechanical Data Case: SOT26 DC - DC Converters Case Material: Molded Plastic, Green Molding Compound. Power Management Functions UL Flammability Classification Rating 94V-0 Disconnect Switches Moisture Sensitivity: Level 1 per J-STD-020 Motor Control Terminals: Finish Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 Weight: 0.015 grams (Approximate) SOT26 Top View Pinout Top-view Device Symbol Ordering Information (Note 4) Part Number Reel Size (inch) Tape Width (mm) Quantity Per Reel ZXMN10B08E6TA 7 8 3,000 ZXMN10B08E6TC 13 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXMN10B08E6 Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Drain-Source Voltage V 100 V DSS Gate-Source Voltage V 20 V GSS (Note 6) 1.9 Continuous Drain Current V = 10V T = +70C (Note 6) I 1.5 A GS A D (Note 5) 1.6 Pulsed Drain Current (Note 7) I 9 A DM Continuous Source Current (Body Diode) (Note 6) I 2.5 A S Pulsed Source Current (Body Diode) (Note 7) I 9 A SM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit 1.1 Power Dissipation W (Note 5) P D Linear Derating Factor 8.8 mW/C 1.7 Power Dissipation W (Note 6) P D Linear Derating Factor 13.6 mW/C (Note 5) 113 Thermal Resistance, Junction to Ambient C/W R JA (Note 6) 73 Operating and Storage Temperature Range -55 to +150 T , T C J STG Notes: 5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. 6. For a device surface mounted on FR4 PCB measured at t 5 secs. 7. Repetitive rating 25mm x 25mm FR4 PCB, D = 0.02, pulse width 300s - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. Thermal Characteristics 2 of 7 March 2015 ZXMN10B08E6 Diodes Incorporated www.diodes.com Datasheet Number: DS33570 Rev. 3 2 NEW PRODUCT