Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductors system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore ( ), the underscore ( ) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore ( ). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild questions onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductors product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. Typical parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FDZ661PZ P-Channel 1.5 V Specified PowerTrench Thin WL-CSP MOSFET December 2011 FDZ661PZ P-Channel 1.5 V Specified PowerTrench Thin WL-CSP MOSFET -20 V, -2.6 A, 140 m Features General Description Max r = 140 m at V = -4.5 V, I = -2 A Designed on Fairchild s advanced 1.5 V PowerTrench process DS(on) GS D with state of the artfine pitc Thin WLCSP packaging process, Max r = 182 m at V = -2.5 V, I = -1.5 A DS(on) GS D the FDZ661PZ minimizes both PCB space and r . This DS(on) Max r = 231 m at V = -1.8 V, I = -1 A advanced WLCSP MOSFET embodies a breakthrough in DS(on) GS D packaging technology which enables the device to combine Max r = 315 m at V = -1.5 V, I = -1 A DS(on) GS D excellent thermal transfer characteristics, ultra-low profile (0.4 2 2 Occupies only 0.64 mm of PCB area. Less than 16% of the mm) and small (0.8x0.8 mm ) packaging, low gate charge, and area of 2 x 2 BGA low r . DS(on) Ultra-thin package: less than 0.4 mm height when mounted Applications to PCB Battery management HBM ESD protection level > 2 kV (Note3) Load switch RoHS Compliant Battery protection Pin 1 S S D G Pin 1 BOTTOM TOP WL-CSP 0.8X0.8 Thin MOSFET Maximum Ratings T = 25 C unless otherwise noted A Symbol Parameter Ratings Units V Drain to Source Voltage -20 V DS V Gate to Source Voltage 8 V GS -Continuous T = 25 C (Note 1a) -2.6 A I A D -Pulsed -10 Power Dissipation T = 25 C (Note 1a) 1.3 A P W D Power Dissipation T = 25 C (Note 1b) 0.4 A T , T Operating and Storage Junction Temperature Range -55 to +150 C J STG Thermal Characteristics R Thermal Resistance, Junction to Ambient (Note 1a) 93 JA C/W R Thermal Resistance, Junction to Ambient (Note 1b) 311 JA Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity EH FDZ661PZ WL-CSP 0.8X0.8 Thin 7 8 mm 5000 units 2011 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FDZ661PZ Rev.C