Ultra-Low VF Schottky Rectifier, 20 A, 120 V FSV20120V Features UltraLow Forward Voltage Drop Low Thermal Resistance www.onsemi.com Very Low Profile: Typical Height of 1.1 mm Anode 1 Trench Schottky Technology 3 Green Molding Compound as per IEC61249 Standard Cathode Anode 2 NonDAP Option Only Schottky Rectifier These Devices are PbFree, Halogen Free and are RoHS Compliant 3 Specifications 2 ABSOLUTE MAXIMUM RATINGS (T = 25C unless otherwise noted) A 1 Symbol Parameter Value Unit TO277 CASE 340BQ V Peak Repetitive Reverse Voltage 120 V RRM V Working Peak Reverse Voltage 120 V MARKING DIAGRAM RWM V RMS Reverse Voltage 85 V RMS Y&Z&3 V DC Blocking Voltage 120 V R FSV20120V I Average Rectified Peak Forward Surge 20 A F(AV) Current Y = ON Semiconductor Logo I NonRepetitive Peak Forward Surge 270 A &Z = Assembly Plant Code FSM Current &3 = Date Code (Year & Week) FSV20120V = Specific Device Code C T Operating Junction Temperature Range 55 to +150 J C T Storage Temperature Range 55 to +150 STG ORDERING INFORMATION Stresses exceeding those listed in the Maximum Ratings table may damage the See detailed ordering and shipping information on page 2 of device. If any of these limits are exceeded, device functionality should not be this data sheet. assumed, damage may occur and reliability may be affected. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: April, 2020 Rev. 3 FSV20120V/DFSV20120V THERMAL CHARACTERISTICS (T = 25C unless otherwise noted) (Note 1) A Minimum Maximum Land Pattern Land Pattern Symbol Parameter Unit R JunctiontoAmbient Thermal Resistance 100 40 C/W JA JunctiontoLead Thermal Characteristics, Thermocouple Soldered to Anode 15 12 C/W JL JunctiontoLead Thermal Characteristics, Thermocouple Soldered to Cathode 6 5 1. The thermal resistances (R & ) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1 JA JL and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2). Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils. F S F S F F F S S S Figure 1. Minimum Land Pattern of 2 oz Copper Figure 2. Maximum Land Pattern of 2 oz Copper ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) A Symbol Parameter Conditions Min Typ Max Unit BV Breakdown Voltage I = 0.5 mA 120 V R R V Forward Voltage Drop I = 20 A 0.79 V F F A I Reverse Current V = 120 V 35 R R Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. ORDERING INFORMATION Part Number Top Mark Package Shipping FSV20120V FSV20120V TO277 3L 5000 / Tape & Reel (PbFree/Halogen Free) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 2