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NB6N14SMNG

NB6N14SMNG electronic component of ON Semiconductor
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See Product Specifications
Part No. NB6N14SMNG
Manufacturer: ON Semiconductor
Category: Clock Buffer
Description: ON Semiconductor Clock Buffer HF LVDS FANOUT BUFF TRANS
Datasheet: NB6N14SMNG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 19.6586 ea
Line Total: USD 19.66

357 - Global Stock
Ships to you between
Thu. 30 May to Wed. 05 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
357 - WHS 1


Ships to you between Thu. 30 May to Wed. 05 Jun

MOQ : 1
Multiples : 1
1 : USD 16.1846
10 : USD 15.0955
25 : USD 13.3891
123 : USD 12.8153
369 : USD 12.1185
615 : USD 11.8152
1107 : USD 11.0573

     
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RoHS - XON
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Number of Outputs
Supply Voltage - Max
Supply Voltage - Min
Propagation Delay - Max
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We proudly offer the NB6N14SMNG Clock Buffer at competitive prices in the United States, Australia, India, Europe and more. By maintaining strong relationships with manufacturers and optimizing our operations, we provide significant savings to our customers. Customer satisfaction is at the heart of our business. Our knowledgeable and friendly customer service team is always ready to assist you with any inquiries or issues. From product selection to after-sales support, we are dedicated to providing our customers with a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why we are the top choice for the NB6N14SMNG Clock Buffer.

NB6N14S 3.3 V 1:4 AnyLevel Differential Input to LVDS Fanout Buffer/Translator The NB6N14S is a differential 1:4 Clock or Data Receiver and will accept AnyLevel differential input signals: LVPECL, CML or NB6N14S Q0 Q0 V GND Exposed Pad (EP) CC 16 15 14 13 Table 1. TRUTH TABLE Q1 1 12 IN IN IN EN Q Q Q1 2 11 V T 01 1 0 1 NB6N14S Q2 3 10 V 10 1 1 0 REF AC x x 0 0 (Note 1) 1 (Note 1) Q2 4 9 IN 1. On next transition of the input signal (IN). 56 7 8 Q3 Q3 V EN CC Figure 3. NB6N14S Pinout, 16pin QFN (Top View) Table 2. PIN DESCRIPTION Pin Name I/O Description 1 Q1 LVDS Output Noninverted IN output. Typically loaded with 100 receiver termination resistor across differential pair. 2 Q1 LVDS Output Inverted IN output. Typically loaded with 100 receiver termination resistor across differential pair. 3 Q2 LVDS Output Noninverted IN output. Typically loaded with 100 receiver termination resistor across differential pair. 4 Q2 LVDS Output Inverted IN output. Typically loaded with 100 receiver termination resistor across differential pair. 5 Q3 LVDS Output Noninverted IN output. Typically loaded with 100 receiver termination resistor across differential pair. 6 Q3 LVDS Output Inverted IN output. Typically loaded with 100 receiver termination resistor across differential pair. 7 V Positive Supply Voltage. CC 8 EN LVTTL / LVCMOS Input Synchronous Output Enable. When LOW, Q outputs will go LOW and Qb outputs will go HIGH on the next negative transition of IN input. The internal DFF register is clocked on the falling edge of IN input see Figure 23. The EN pin has an internal pullup resistor and defaults HIGH when left open. 9 IN LVPECL, CML, LVDS Inverted Differential Input 10 V LVPECL Output The V reference output can be used to rebias capacitorcoupled REF AC REF AC differential or singleended input signals. For the capacitor coupled IN and/or INb inputs, V should be connected to the VT pin and bypassed to REF AC ground with a 0.01 F capacitor. 11 V LVPECL Output Internal 100 Centertapped Termination Pin for IN and IN T 12 IN LVPECL, CML, LVDS Noninverted Differential Input. (Note 2) 13 GND Negative Supply Voltage. 14 V Positive Supply Voltage. CC 15 Q0 LVDS Output Noninverted IN output. Typically loaded with 100 receiver termination resistor across differential pair. 16 Q0 LVDS Output Inverted IN output. Typically loaded with 100 receiver termination resistor across differential pair. EP The Exposed Pad (EP) on the QFN16 package bottom is thermally connected to the die for improved heat transfer out of package. The exposed pad must be attached to a heatsinking conduit. The pad is not electrically connected to the die, but is recommended to be electrically and thermally connected to GND on the PC board. 2. In the differential configuration, when the input termination pin (VT) is connected to a termination voltage or left open, and if no signal is applied on IN/IN inputs, then the device will be susceptible to selfoscillation.

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Aptina / ON Semiconductor
FAIRCHILD
FAIRCHILD (ON SEMICONDUCTOR)
Fairchild Semiconductor
FS8
FSC
ON
ON SEMI
ON Semicon
ON SEMICONDUCTOR
ON SEMICONDUCTOR (FAIRCHILD)
ON Semiconductor / Fairchild
ON4
ON5
onsemi
ON-SEMI
onsemi / Fairchild
OOF
Xsens / Fairchild

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