Product Information

NDD02N40T4G

NDD02N40T4G electronic component of ON Semiconductor

Datasheet
ON Semiconductor MOSFET NFET DPAK 400V 1.7A 5.5OH

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

Stock Image

NDD02N40T4G
ON Semiconductor

1 : USD 0.5884
10 : USD 0.4805
100 : USD 0.2931
1000 : USD 0.2267
2500 : USD 0.1987
10000 : USD 0.1987
25000 : USD 0.1964
50000 : USD 0.1919
100000 : USD 0.184
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Brand
Factory Pack Quantity :
Configuration
Transistor Type
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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NDD02N40, NDT02N40 N-Channel Power MOSFET 400 V, 5.5 Features 100% Avalanche Tested These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS NDD02N40, NDT02N40 ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Characteristic Symbol Test Conditions Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V =0V, I =1mA 400 V (BR)DSS GS D DraintoSource Breakdown Voltage V /T Reference to 25C, 460 mV/C (BR)DSS J Temperature Coefficient I = 1 mA D DraintoSource Leakage Current I V = 400 V, V =0V T =25C 1 A DSS DS GS J T = 125C 50 J GatetoSource Leakage Current I V = 20 V 10 A GSS GS ON CHARACTERISTICS (Note 6) Gate Threshold Voltage V V =V , I = 250 A 0.8 1.6 2 V GS(TH) DS GS D Negative Threshold Temperature Co- V /T Reference to 25C, I = 50 A 4.6 mV/C GS(TH) J D efficient Static Drain-to-Source On Resistance R V =10V, I = 0.22 A 4.5 5.5 DS(on) GS D Forward Transconductance g V =15V, I = 0.22 A 1.1 S FS DS D DYNAMIC CHARACTERISTICS Input Capacitance (Note 7) C 121 pF iss Output Capacitance (Note 7) C 16 oss V =25V, V = 0 V, f = 1 MHz DS GS Reverse Transfer Capacitance C 3 rss (Note 7) Total Gate Charge (Note 7) Q 5.5 nC g Gate-to-Source Charge (Note 7) Q 0.8 gs V = 200 V, I = 1.7 A, V =10V DS D GS Gate-to-Drain (Miller) Charge Q 1.0 gd (Note 7) Plateau Voltage V 3.1 V GP Gate Resistance R 8.7 g RESISTIVE SWITCHING CHARACTERISTICS (Note 8) Turn-on Delay Time t 5 ns d(on) Rise Time t 7 r V = 200 V, I = 1.7 A, DD D V =10V, R = 0 GS G Turn-off Delay Time t 14 d(off) Fall Time t 4 f SOURCEDRAIN DIODE CHARACTERISTICS Diode Forward Voltage V T =25C 0.9 1.6 V SD J I = 1.7 A, V =0V S GS T = 100C 0.8 J Reverse Recovery Time t 146 ns rr Charge Time t 37 a V =0V, V = 30 V, I = 1.7 A, GS DD S d /d = 100 A/ s i t Discharge Time t 109 b Reverse Recovery Charge Q 260 nC rr Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 6. Pulse Width 380 s, Duty Cycle 2%. 7. Guaranteed by design. 8. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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