Product Information

NDT02N40T1G

NDT02N40T1G electronic component of ON Semiconductor

Datasheet
ON Semiconductor MOSFET NFET SOT223 400V 1.7A

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.2841 ea
Line Total: USD 0.28

5 - Global Stock
Ships to you between
Fri. 24 May to Thu. 30 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
5 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1

Stock Image

NDT02N40T1G
ON Semiconductor

1 : USD 0.2151

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Series
Brand
Factory Pack Quantity :
Configuration
Transistor Type
Forward Transconductance - Min
Cnhts
Fall Time
Hts Code
Mxhts
Product Type
Rise Time
Subcategory
Taric
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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NDD02N40, NDT02N40 N-Channel Power MOSFET 400 V, 5.5 Features 100% Avalanche Tested These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS NDD02N40, NDT02N40 ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Characteristic Symbol Test Conditions Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V =0V, I =1mA 400 V (BR)DSS GS D DraintoSource Breakdown Voltage V /T Reference to 25C, 460 mV/C (BR)DSS J Temperature Coefficient I = 1 mA D DraintoSource Leakage Current I V = 400 V, V =0V T =25C 1 A DSS DS GS J T = 125C 50 J GatetoSource Leakage Current I V = 20 V 10 A GSS GS ON CHARACTERISTICS (Note 6) Gate Threshold Voltage V V =V , I = 250 A 0.8 1.6 2 V GS(TH) DS GS D Negative Threshold Temperature Co- V /T Reference to 25C, I = 50 A 4.6 mV/C GS(TH) J D efficient Static Drain-to-Source On Resistance R V =10V, I = 0.22 A 4.5 5.5 DS(on) GS D Forward Transconductance g V =15V, I = 0.22 A 1.1 S FS DS D DYNAMIC CHARACTERISTICS Input Capacitance (Note 7) C 121 pF iss Output Capacitance (Note 7) C 16 oss V =25V, V = 0 V, f = 1 MHz DS GS Reverse Transfer Capacitance C 3 rss (Note 7) Total Gate Charge (Note 7) Q 5.5 nC g Gate-to-Source Charge (Note 7) Q 0.8 gs V = 200 V, I = 1.7 A, V =10V DS D GS Gate-to-Drain (Miller) Charge Q 1.0 gd (Note 7) Plateau Voltage V 3.1 V GP Gate Resistance R 8.7 g RESISTIVE SWITCHING CHARACTERISTICS (Note 8) Turn-on Delay Time t 5 ns d(on) Rise Time t 7 r V = 200 V, I = 1.7 A, DD D V =10V, R = 0 GS G Turn-off Delay Time t 14 d(off) Fall Time t 4 f SOURCEDRAIN DIODE CHARACTERISTICS Diode Forward Voltage V T =25C 0.9 1.6 V SD J I = 1.7 A, V =0V S GS T = 100C 0.8 J Reverse Recovery Time t 146 ns rr Charge Time t 37 a V =0V, V = 30 V, I = 1.7 A, GS DD S d /d = 100 A/ s i t Discharge Time t 109 b Reverse Recovery Charge Q 260 nC rr Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 6. Pulse Width 380 s, Duty Cycle 2%. 7. Guaranteed by design. 8. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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