Product Information

NTD4815NT4G

NTD4815NT4G electronic component of ON Semiconductor

Datasheet
MOSFET NFET 30V 35A 15MOHM

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1886: USD 0.223 ea
Line Total: USD 420.58

0 - Global Stock
MOQ: 1886  Multiples: 1886
Pack Size: 1886
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 1
Multiples : 1

Stock Image

NTD4815NT4G
ON Semiconductor

1 : USD 0.227
5 : USD 0.2247
50 : USD 0.2118
250 : USD 0.1849
1000 : USD 0.1661

0 - WHS 2


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 1886
Multiples : 1886

Stock Image

NTD4815NT4G
ON Semiconductor

1886 : USD 0.223

0 - WHS 3


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 5000
Multiples : 5000

Stock Image

NTD4815NT4G
ON Semiconductor

5000 : USD 0.2166

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs - Gate-Source Breakdown Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Channel Mode
Configuration
Brand
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
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NTD4815N, NVD4815N Power MOSFET 30 V, 35 A, Single NChannel, DPAK/IPAK Features Low R to Minimize Conduction Losses DS(on) Low Capacitance to Minimize Driver Losses NTD4815N, NVD4815N THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit JunctiontoCase (Drain) R 4.6 C/W JC JunctiontoTAB (Drain) R 3.5 JCTAB JunctiontoAmbient Steady State (Note 1) R 78 JA JunctiontoAmbient Steady State (Note 2) R 119 JA 1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 2. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D DraintoSource Breakdown Voltage V / 25 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25 C 1 DSS GS J V = 24 V A DS T = 125C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V V = V , I = 250 A 1.5 2.5 V GS(TH) GS DS D Negative Threshold Temperature V /T 5.6 GS(TH) J mV/C Coefficient DraintoSource On Resistance R V = 10 V to I = 30 A 12 15 DS(on) GS D 11.5 V I = 15 A 11.5 D m V = 4.5 V I = 30 A 21 25 GS D I = 15 A 18.3 D Forward Transconductance g V = 15 V, I = 10 A 6.0 S FS DS D CHARGES AND CAPACITANCES Input Capacitance C 770 ISS Output Capacitance C V = 0 V, f = 1.0 MHz, V = 12 V 181 pF OSS GS DS Reverse Transfer Capacitance C 108 RSS Total Gate Charge Q 6.0 6.6 G(TOT) Threshold Gate Charge Q 0.9 G(TH) V = 4.5 V, V = 15 V I = 30 A nC GS DS D GatetoSource Charge Q 2.5 GS GatetoDrain Charge Q 3.1 GD Total Gate Charge Q V = 11.5 V, V = 15 V 14.1 nC G(TOT) GS DS I = 30 A D SWITCHING CHARACTERISTICS (Note 4) TurnOn Delay Time t 10.5 d(ON) Rise Time t 21.4 r V = 4.5 V, V = 15 V, I = 15 A, GS DS D ns R = 3.0 G TurnOff Delay Time t 11.4 d(OFF) Fall Time t 3.5 f Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: pulse width 300 s, duty cycle 2%. 4. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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