X-On Electronics has gained recognition as a prominent supplier of NTMFS4936NCT1G MOSFETs across the USA, India, Europe, Australia, and various other global locations. NTMFS4936NCT1G MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

NTMFS4936NCT1G ON Semiconductor

NTMFS4936NCT1G electronic component of ON Semiconductor
NTMFS4936NCT1G ON Semiconductor
NTMFS4936NCT1G MOSFETs
NTMFS4936NCT1G  Semiconductors

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Part No. NTMFS4936NCT1G
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: N-Channel 30 V 11.6A (Ta), 79A (Tc) 920mW (Ta), 43W (Tc) Surface Mount 5-DFN (5x6) (8-SOFL)
Datasheet: NTMFS4936NCT1G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1500: USD 0.4034 ea
Line Total: USD 605.1 
Availability - 0
Ship by Thu. 26 Jun
MOQ: 1500  Multiples: 1500
Pack Size: 1500
Availability Price Quantity
0
Ship by Wed. 02 Jul to Tue. 08 Jul
MOQ : 1500
Multiples : 1500
1500 : USD 0.4034

0
Ship by Wed. 02 Jul to Tue. 08 Jul
MOQ : 3000
Multiples : 3000
3000 : USD 0.4446

   
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RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Pd - Power Dissipation
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NTMFS4936N, NTMFS4936NC MOSFET Power, Single, N-Channel, SO-8 FL 30 V, 79 A Features NTMFS4936N, NTMFS4936NC MAXIMUM RATINGS (T = 25C unless otherwise stated) J Parameter Symbol Value Unit Single Pulse DraintoSource Avalanche E 96.8 mJ AS Energy (T = 25C, V = 50 V, V = 10 V, J DD GS I = 44 A , L = 0.1 mH, R = 25 ) L pk G Lead Temperature for Soldering Purposes T 260 C L (1/8 from case for 10 s) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 2. Surfacemounted on FR4 board using the minimum recommended pad size. THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit JunctiontoCase (Drain) R 2.9 JC JunctiontoAmbient Steady State (Note 3) R 47.7 JA C/W JunctiontoAmbient Steady State (Note 4) R 135.2 JA JunctiontoAmbient (t 10 s) (Note 3) R 14.8 JA 3. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 4. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V 30 V V = 0 V, I = 250 A (BR)DSS GS D DraintoSource Breakdown Voltage V VGS = 0 V, I = 18.5 A, 34 V (BR)DSSt D(aval) (transient) T = 25C, t = 100 ns case transient DraintoSource Breakdown Voltage V / 15 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25C 1.0 DSS GS J V = 24 V A DS T = 125C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 5) Gate Threshold Voltage V V = V , I = 250 A 1.2 1.6 2.2 V GS(TH) GS DS D Negative Threshold Temperature Coefficient V /T 4.0 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 30 A 2.9 3.8 DS(on) GS D I = 15 A 2.9 D m V = 4.5 V I = 30 A 3.9 4.8 GS D I = 15 A 3.9 D Forward Transconductance g V = 1.5 V, I = 15 A 50 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 3044 ISS Output Capacitance C 1014 V = 0 V, f = 1 MHz, V = 15 V pF OSS GS DS Reverse Transfer Capacitance C 39 RSS Capacitance Ratio C / V = 0 V, V = 15 V, f = 1 MHz 0.013 0.026 RSS GS DS C ISS 5. Pulse Test: pulse width 300 s, duty cycle 2%. 6. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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