Product Information

NTMFS5H414NLT1G

Hot NTMFS5H414NLT1G electronic component of ON Semiconductor

Datasheet
MOSFET T8 40V LOW COSS POWER MOSFET

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.3348 ea
Line Total: USD 1.33

161 - Global Stock
Ships to you between
Fri. 10 May to Thu. 16 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
161 - WHS 1


Ships to you between Fri. 10 May to Thu. 16 May

MOQ : 1
Multiples : 1

Stock Image

NTMFS5H414NLT1G
ON Semiconductor

1 : USD 1.3348

557 - WHS 2


Ships to you between Thu. 16 May to Mon. 20 May

MOQ : 1
Multiples : 1

Stock Image

NTMFS5H414NLT1G
ON Semiconductor

1 : USD 5.2095
10 : USD 4.4275
25 : USD 4.37
100 : USD 3.68
250 : USD 3.634
500 : USD 3.3695
1000 : USD 3.151
1500 : USD 2.99
3000 : USD 2.967

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Transistor Type
Brand
Fall Time
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Cnhts
Hts Code
Mxhts
LoadingGif

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NTMFS5H414NL MOSFET Single, N-Channel 40 V, 1.4 m , 210 A Features Small Footprint (5x6 mm) for Compact Design www.onsemi.com Low R to Minimize Conduction Losses DS(on) Low Q and Capacitance to Minimize Driver Losses G V R MAX I MAX (BR)DSS DS(ON) D These Devices are PbFree and are RoHS Compliant 1.4 m 10 V 40 V 210 A MAXIMUM RATINGS (T = 25C unless otherwise noted) J 2.0 m 4.5 V Parameter Symbol Value Unit DraintoSource Voltage V 40 V DSS D (5) GatetoSource Voltage V 20 V GS Continuous Drain T = 25C I 210 A C D Current R JC T = 100C 130 (Notes 1, 3) C Steady G (4) State Power Dissipation T = 25C P 110 W C D R (Note 1) JC T = 100C 45 C S (1,2,3) Continuous Drain T = 25C I 35 A A D NCHANNEL MOSFET Current R JA T = 100C 22 (Notes 1, 2, 3) A Steady State Power Dissipation T = 25C P 3.1 W D A MARKING R (Notes 1 & 2) JA T = 100C 1.3 A DIAGRAM Pulsed Drain Current T = 25C, t = 10 s I 900 A A p DM D 1 S D Operating Junction and Storage Temperature T , T 55 to C J stg DFN5 5H414L + 150 S (SO8FL) AYWZZ S Source Current (Body Diode) I 120 A S CASE 488AA G D STYLE 1 D Single Pulse DraintoSource Avalanche E 290 mJ AS Energy (I = 44 A) L(pk) 5H414L = Specific Device Code Lead Temperature for Soldering Purposes T 260 C A = Assembly Location L (1/8 from case for 10 s) Y = Year W = Work Week Stresses exceeding those listed in the Maximum Ratings table may damage the ZZ = Lot Traceability device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS ORDERING INFORMATION Parameter Symbol Value Unit See detailed ordering, marking and shipping information on JunctiontoCase Steady State R 1.1 C/W page 5 of this data sheet. JC JunctiontoAmbient Steady State (Note 2) R 39 JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2 , 2 oz. Cu pad. 2. Surfacemounted on FR4 board using a 650 mm 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: May, 2019 Rev. 0 NTMFS5H414NL/DNTMFS5H414NL ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 40 V (BR)DSS GS D DraintoSource Breakdown Voltage V / 17 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25C 10 DSS GS J V = 40 V A DS T = 125C 250 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 4) Gate Threshold Voltage V V = V , I = 250 A 1.2 1.55 2.0 V GS(TH) GS DS D Threshold Temperature Coefficient V /T 4.5 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 20 A 1.1 1.4 DS(on) GS D m V = 4.5 V I = 20 A 1.5 2.0 GS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 4550 ISS Output Capacitance C 985 V = 0 V, f = 1 MHz, V = 20 V pF OSS GS DS Reverse Transfer Capacitance C 74 RSS Output Charge Q V = 0 V, V = 20 V 45 nC OSS GS DD Total Gate Charge Q V = 4.5 V, V = 20 V I = 20 A 35 G(TOT) GS DS D Total Gate Charge Q V = 10 V, V = 20 V I = 20 A 75 G(TOT) GS DS D Threshold Gate Charge Q 7.0 nC G(TH) GatetoSource Charge Q 11.5 GS V = 4.5 V, V = 20 V I = 20 A GS DS D GatetoDrain Charge Q 10 GD Plateau Voltage V 2.6 V GP Gate Resistance R T = 25C 0.7 G A SWITCHING CHARACTERISTICS (Note 5) TurnOn Delay Time t 15.2 d(ON) Rise Time t 52.3 r V = 4.5 V, V = 20 V, GS DS ns I = 20 A, R = 2.5 D G TurnOff Delay Time t 38.8 d(OFF) Fall Time t 11.6 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.75 1.2 SD J V = 0 V, GS V I = 20 A S T = 125C 0.6 J Reverse Recovery Time t 51.7 RR Charge Time t 28.1 a ns V = 0 V, dI /dt = 100 A/ s, GS S I = 20 A S Discharge Time t 23.6 b Reverse Recovery Charge Q 68 nC RR Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width 300 s, duty cycle 2%. 5. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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