PSIS100/12 Powersem

PSIS100/12 electronic component of Powersem
PSIS100/12 Powersem
PSIS100/12 IGBT Modules
PSIS100/12  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of PSIS100/12 IGBT Modules across the USA, India, Europe, Australia, and various other global locations. PSIS100/12 IGBT Modules are a product manufactured by Powersem. We provide cost-effective solutions for IGBT Modules, ensuring timely deliveries around the world.

Part No.PSIS100/12
Manufacturer:Powersem
Category:IGBT Modules
Description:Brake chopper; Urmax:1.2kV; Ic:94A; Ifsm:150A; ECO-PAC 2; screw
Datasheet:PSIS100/12 Datasheet (PDF)
Shipping Charges:Click here for details
AI Image
Price (USD)
  
1: USD 42.3301 ea
Line Total: USD 42.33 
Availability : 0
  
QtyUnit Price
1$ 42.3301
3$ 42.3009
  

Availability0
Ship by Mon. 22 Jun to Wed. 24 Jun
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 42.3301
3$ 42.3009

   
Manufacturer
Product Category
Power Dissipation
Topology
Semiconductor Structure
Application
Mounting
Electrical Mounting
Case
Type Of Module
Max Forward Impulse Current
Collector Current
Gate-Emitter Voltage
Max Off-State Voltage
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the PSIS100/12 from our IGBT Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the PSIS100/12 and other electronic components in the IGBT Modules category and beyond.

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TM ECO-PAC 2 PSIG 100/12 IGBT Module I = 138 A C25 PSIS 100/12* V = 1200 V Short Circuit SOA Capability CES PSSI 100/12* Square RBSOA V = 2.8 V CE(sat)typ. Preliminary Data Sheet X15 AC 1 IK 10 NTC AIJK LMN S L9 T16 X16 X15 L9 F1 NTC IK 10 AC 1 X16 PSIG 100/12 PSIS 100/12* PSSI 100/12* IGBTs *NTC optional Symbol Conditions Maximum Ratings V T = 25C to 150C 1200 V Features CES VJ Package with DCB ceramic V 20 V GES base plate I T = 25C 138 A Isolation voltage 3000 V C25 C I T = 80C 94 A C80 C Planar glass passivated chips Low forward voltage drop I V = 15 V R = 15 T = 125C 150 A CM GE VJ G Leads suitable for PC board V RBSOA, Clamped inductive load L = 100 H V CEK CES soldering t V = V V = 15 V R = 15 T = 125C 10 s CES GE VJ SC CE G UL registered, E 148688 (SCSOA) non-repetitive P T = 25C 568 W Applications tot C AC and DC motor control AC servo and robot drives Symbol Conditions Characteristic Values power supplies (T = 25C, unless otherwise specified) VJ welding inverters min. typ. max. V I = 125 A V = 15 V T = 25C 2.8 3.4 V VJ CE(sat) C GE Advantages T = 125C 3.2 V VJ Easy to mount with two screws V I = 3 mA V = V 4.5 6.5 V Space and weight savings GE(th) C GE CE Improved temperature and I V = V V = 0 V T = 25C 5 mA VJ CES CE CES GE power cycling capability T = 125C 16 mA VJ I V = 0 V V = 20 V 320 nA GES CE GE t 100 ns d(on) Inductive load, T = 125C t VJ 50 ns r V = 600 V I = 75 A t 650 ns CE C d(off) V = 15/0 V R = 15 t 50 ns GE G f E 12.1 mJ on E 10.5 mJ off C V = 25 V V = 0 V f = 1 MHz 5.5 nF ies CE GE R (per IGBT) 0.22 K/W thJC R with heatsink compound (0.42 K/m.K 50 m) 0.44 K/W thJH Caution: These Devices are sensitive to electrostatic discharge. Users should observe proper ESD handling precautions. 2002 POWERSEM reserves the right to change limits, test conditions and dimensions POWERSEM GmbH, Walpersdorfer Str. 53 D - 91126 Schwabach Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20PSIG PSIS PSSI 100/12 Reverse diodes (FRED) Package style and outline Symbol Conditions Maximum Ratings Dimensions in mm (1mm = 0.0394) I T = 25C 154 A F25 C I T = 80C 97 A F80 C PSIG Symbol Conditions Characteristic Values min. typ. max. V I = 75 A T = 25C 2.2 2.5 V VJ F F T = 125C 1.6 V VJ I I = 75 A di /dt = 750 A/s T = 125C 79 A VJ RM F F t V = 600 V V = 0 V 220 ns rr R GE R 0.45 K/W thJC R with heatsink compound (0.42 K/m.K 50 m) 0.9 K/W thJH Temperature Sensor NTC Symbol Conditions Characteristic Values min. typ. max. R T = 25C 4.75 5.0 5.25 k 25 B 3375 K 25/50 PSSI Module Symbol Conditions Maximum Ratings T -40...+150 C VJ T -40...+150 C stg V I 1 mA 50/60 Hz 3000 V~ ISOL ISOL M Mounting torque (M4) 1.5 - 2.0 Nm d 14 - 18 lb.in. 2 a Max. allowable acceleration 50 m/s Symbol Conditions Characteristic Values min. typ. max. d Creepage distance on surface (Pin to heatsink) 11.2 mm S d Strike distance in air (Pin to heatsink) 11.2 mm A PSIS Weight 24 g 2002 POWERSEM reserves the right to change limits, test conditions and dimensions POWERSEM GmbH, Walpersdorfer Str. 53 D - 91126 Schwabach Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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