F2970 75 Ohm SP2T RF Switch 5 MHz to 3000 MHz Datasheet Description Features The F2970 is a high reliability, low insertion loss, 75 absorptive Low Insertion Loss: SP2T RF switch designed for a multitude of cable systems and 0.32 dB 1200 MHz other RF applications. This device covers a broad frequency High Isolation: range from 5 MHz to 3000 MHz. In addition to providing low 70 dB 1200 MHz (RF1/RF2 to RFC) insertion loss, the F2970 also delivers excellent linearity and Excellent Linearity: isolation performance while providing a 75 termination for the IIP3 of 63 dBm unselected port. Selectable Logic Control The F2970 uses a single positive supply voltage and supports Operating Temperature: -40 C to +105 C 3.3 V logic. 4 mm x 4 mm 20-pin LQFN package Block Diagram Competitive Advantage Figure 1. Block Diagram The F2970 provides broadband RF performance to support the CATV market along with high power handling, and high isolation. RFC Low Insertion Loss High Isolation Excellent Linearity Extended Temperature: -40 C to +105 C Typical Applications RF1 RF2 CATV/Broadband Applications 75 75 Headend Fiber/HFC Distribution Nodes Distribution Amplifiers Switch Matrix DTV Tuner Input Select C1 C2 DVR/PVR/Set-top box CATV Test Equipment 2016 Integrated Device Technology, Inc. 1 November 11, 2016 F2970 Datasheet Pin Assignments Figure 2. Pin Assignments for 4 mm x 4 mm x 0.75 mm 20-pin LQFN, NCG20 Top View Pin Descriptions Table 1. Pin Descriptions Number Name Description 1, 2, 4, 5, 6, 7, 9, 10, 11, GND Ground these pins as close to the device as possible. 12, 14, 15, 18, 19 RF1 Port. Matched to 75 ohms. If this pin is not 0V DC, then an external coupling capacitor must be 3 RF1 used. RFC Port. Matched to 75 ohms. If this pin is not 0V DC, then an external coupling capacitor must be 8 RFC used. RF2 Port. Matched to 75 ohms. If this pin is not 0V DC, then an external coupling capacitor must be 13 RF2 used. 16 C2 Control pin to set switch state. See Table 8. 17 C1 Control pin to set switch state. See Table 8. Power Supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as 20 V DD possible to pin. Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple EP ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the specified RF performance. 2016 Integrated Device Technology, Inc. 2 November 11, 2016