Product Information

BM92A21MWV-ZE2

BM92A21MWV-ZE2 electronic component of ROHM

Datasheet
USB Interface IC Provider, DFP Pwr Sply USB Type-C

Manufacturer: ROHM
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 8.586 ea
Line Total: USD 8.59

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Thu. 02 May to Mon. 06 May

MOQ : 1
Multiples : 1
1 : USD 8.586
10 : USD 3.0888
25 : USD 2.916
100 : USD 2.5272
250 : USD 2.3976
500 : USD 2.16
1000 : USD 1.836
2500 : USD 1.7712
5000 : USD 1.7064

     
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RoHS - XON
Icon ROHS
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Data Rate
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Supply Voltage - Max
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Development Kit
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DSCHG VB SPDSRC G1 SPDSRC SRC SPDSRC G2 VEX LDISCHG G1 LDISCHG SRC LDISCHG G2 VDIV FB IFB Datasheet USB Type-C Power Delivery Controller BM92A21MWV-Z General Description Key Specifications BM92A21 is a USB Type-C Power Delivery (PD) VEX Voltage Range: 4.75V to 20V controller that supports USB Power Delivery using VBUS Voltage Range: 4.75V to 20V base-band communication. It is compatible with USB Power Consumption at Sleep Power: 0.9mW(Typ) Type-C Specification and USB Power Delivery Operating Temperature Range: -30C to +105C specification. BM92A21 includes support for the PD policy engine and Package W (Typ) x D (Typ) x H (Max) be able to operate independently. In addition, this IC has UQFN40V5050A 5.00mm x 5.00mm x 1.00mm secondary side error amplifier that support variable output voltage and it is suitable for PD AC adapter systems. Features USB Type-C Specification compatible USB PD Specification compatible (BMC-PHY) Power path control using N-channel MOSFET drivers with back flow prevention Type-C cable orientation detection Supports DFP-SOURCE mode Integrated Secondary side of AC adapter system PDO1:5V/3A, PDO2:9V/3A, PDO3:12V/3A, PDO4:15V/3A, PDO5:20V/5A EC-less Operation (Auto mode) Applications Consumer Applications AC Adaptors, Chargers Typical Application Circuit Q2 Q1 VBUS + SGND SGND SGND SGND IFB ACDC GND SGND SGND Primary VCCIN Side VDDIO R3 CC1 CC1 SMDATA (Open or CC2) CC2 SMCLK VDDIO GPIO0 VCONN IN (Open or 5V Sourece) Captive cable GPIO1 XCLPOFF1 with a USB Type-C plug XCLPOFF2 or BM92A21MWV-Z Type-C GPIO7 UQFN40V5050A GPIO GPIO6 VSVR Receptacle GPIO5 GPIO4 For D+ BC1.2 DBGMODDT DCP D- For TEST VDDIO DBGRSTCK IDSEL/ATST1 VSTR/ATST2 VCCIN XRST VCCIN SGND SGND GND SGND GND Figure A. Typical Application Circuit Product structure : Silicon monolithic integrated circuit This product has no designed protection against radioactive rays . www.rohm.com TSZ02201-0232AA000560-1-2 2017 ROHM Co., Ltd. All rights reserved. 1/31 TSZ22111 14 001 31.Mar.2017 Rev.001 CSENSEN CSENSEP VCCIN LDO15ACAP LDO28CAP LDO15DCAP EPAD GND GND GND SGNDBM92A21MWV-Z Contents Contents ......................................................................................................................................................................................... 2 Notation ......................................................................................................................................................................................... 3 Reference ...................................................................................................................................................................................... 3 1. Pin Configuration.................................................................................................................................................................. 4 2. Pin Description ..................................................................................................................................................................... 5 3. Block Diagram ...................................................................................................................................................................... 7 4. Electrical Characteristics ...................................................................................................................................................... 8 4.1. Absolute Maximum Ratings ................................................................................................................................................. 8 (Note 4) 4.2. Thermal Resistance ..................................................................................................................................................... 8 4.3. Recommended Operating Conditions .................................................................................................................................. 9 4.4. Internal Memory Cell Characteristics ................................................................................................................................... 9 4.5. Circuit Power Characteristics ............................................................................................................................................... 9 4.6. Digital Pin DC Characteristics ............................................................................................................................................ 10 4.7. Power Supply Management ............................................................................................................................................... 11 4.7.1. Outline ............................................................................................................................................................................ 11 4.7.2. Electrical Characteristics ................................................................................................................................................ 12 4.8. CC PHY ............................................................................................................................................................................ 13 4.8.1. Outline ............................................................................................................................................................................ 13 4.8.2. Electrical Characteristics ................................................................................................................................................ 14 4.9. Voltage Detection ............................................................................................................................................................... 15 4.9.1. Outline ............................................................................................................................................................................ 15 4.9.2. Electrical Characteristics ................................................................................................................................................ 15 4.10. VBUS Discharge............................................................................................................................................................. 16 4.10.1. Outline ........................................................................................................................................................................ 16 4.10.2. Electrical Characteristics ............................................................................................................................................. 16 4.11. Power FET Gate Driver (Power Path and Discharge) .................................................................................................... 17 4.11.1. Outline ........................................................................................................................................................................ 17 4.11.2. Electrical Characteristics ............................................................................................................................................. 17 4.12. ACDC Bridge .................................................................................................................................................................. 18 4.12.1. Outline ........................................................................................................................................................................ 18 4.12.2. Electrical Characteristics ............................................................................................................................................. 18 4.13. Power On Sequence ...................................................................................................................................................... 20 4.13.1. Reset Timing ............................................................................................................................................................... 20 4.14. Power Off Sequence ...................................................................................................................................................... 20 4.15. I/O Equivalence Circuit ................................................................................................................................................... 21 5. Application Example ........................................................................................................................................................... 25 5.1. Selection of Components Externally connected ................................................................................................................. 25 6. Firmware Revision ............................................................................................................................................................. 26 7. Operational Notes .............................................................................................................................................................. 27 8. Ordering Information .......................................................................................................................................................... 29 9. Marking Diagrams .............................................................................................................................................................. 29 10. Physical Dimension Tape and Reel Information ................................................................................................................. 30 11. Revision History ................................................................................................................................................................. 31 www.rohm.com TSZ02201-0232AA000560-1-2 2017 ROHM Co., Ltd. All rights reserved. 2/31 TSZ22111 15 001 31.Mar.2017 Rev.001

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
LAPIS Semiconductor
RHE
RHM
ROHM Semicon
ROHM Semiconductor

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