Product Information

CIGW252010GM1R0MNE

CIGW252010GM1R0MNE electronic component of Samsung

Datasheet
Fixed Inductors CIGW,Wire wound,1008,1.0uH,1.0,7 embossed,-20~20%
Manufacturer: Samsung
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

120000: USD 0.0864 ea
Line Total: USD 10368

0 - Global Stock
MOQ: 120000  Multiples: 120000
Pack Size: 120000

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Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 120000
Multiples : 120000
120000 : USD 0.0864

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Additional Infomation About Product

Ver. 201312 Metal Composite Type Power Inductor CIGW252010GM1R0MNE (2520/ EIA 1008) APPLICATION Mobile Phones, LCD & AMOLED Display, HDD, SSD etc. FEATURES RECOMMENDED LAND PATTERN High Current Type Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION Dimension mm TYPE L W T D 22 2.50.2 2.00.2 0.90.1 0.550.25 DESCRIPTION DC 1 2 Rated Current (A) Rated Current (A) Size Inductance Resistance( ) Part no. (inch/mm) (uH) 1MHz Typ. Max. Typ. Max. Typ. Max. CIGW252010GM1R0MNE 1008/2520 1.0 20 % 0.040 0.052 3.7 3.3 3.5 3.3 1 Rated Current (A) : DC current value when Inductance drops by 30% of nominal Inductance value (ONLY REFERENCE) 2 Rated Current (A) : DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:25 ) Operating temperature range: 40 to +125C ( Including self-temperature rise) Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Temperature characteristics (Typ.) 2) DC Bias characteristics (Typ.)Ver. 201312 PRODUCT IDENTIFICATION CIG W 2520 10 GM 1R0 M N E (1) (2) (3) (4) (5) (6) (7) (8) (9) Power Inductor Type W: Winding Type) (1) (2) ( Dimension mm mm) Thickness Max mm) (3) (2520: 2.5 x 2.0 (4) (10: 1.0 Remark GM: General Metal Composite) Inductance R0: uH) (5) ( (6) (1 1.0 Tolerance M: (7) ( 20%) Initial Code (8) Packaging(C:paper tape, E:embossed tape) (9) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3,000pcs Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.

HS Compliance

Tariff Desc

8504.50 COILS, toroidal, having ALL of the following: (a) winding wire dia NOT exceeding 0.25 mm; (b) internal window dia NOT exceeding 40 mm; (c) external dia NOT exceeding 55 mm Op. 17.06.1985 Dec. 13.01.1986 - TC 8532473

8504.90 CORES AND SHAPES, ferrite, iron powder or molybdenum permalloy powder Op. 13.03.1984 Dec. 13.03.1984 - TC 8342777

Samsung may also be referenced as

SAMSUNG
Samsung ARTIK
SAMSUNG ELECTRO-MECH
Samsung Electro-Mechanics
Samsung Electro-Mechanics America, Inc.
SAMSUNG GVI
SAMSUNG LED
SAMSUNG PASSIVES
SAMSUNG SDI
SAMSUNG SEMI
Samsung Semiconductor
Samsung Semiconductor, Inc.
SMP

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