NVAM-DP-04-2-02.0-S-2-K-TR Samtec

EXTREME PERFORMANCE HIGH-DENSITY ARRAYS (0.80 mm) .0315 x (1.80 mm) .071 PITCH FEATURES & BENEFITS 112 Gbps PAM4 per channel 112 fully shielded differential pairs per square inch 4.0 Tbps aggregate data rate - 9 IEEE, 400 G channels Extremely low crosstalk to 40 GHz+ Incredibly tight impedance control Minimal variance in data rate as stack height increases 40% less space vs traditional arrays with the same data throughout High-speed mezzanine BGA attach to board Guaranteed two points connector and cable in for greater density and of contact to ensure a one product family optimized trace more reliable connection breakout region KEY SPECIFICATIONS STACK INSULATOR CONTACT CURRENT WORKING LEAD-FREE TOTAL PAIRS PLATING HEIGHTS MATERIAL MATERIAL RATING VOLTAGE SOLDERABLE 2.1 A per pin (signal) Up to Au or Sn over 7 mm & 10 mm Black LCP Copper Alloy 200 VAC Yes 32 pairs 50 (1.27 m) Ni 9.6 A per pin (ground) F-221 (Rev 21DEC21) samtec.com/NovaRay Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtecs specifications which are subject to change without notice.0.80 mm x 1.80 mm PITCH EXTREME PERFORMANCE ARRAYS NO. OF NO. OF LEAD PLATING SOLDER STYLE SERIES KR - - - - - - - - ROWS BANKS STYLE OPTION TYPE NVAM DP 02 1 02.0 S 2 K TR Terminal = 4 pairs = 1 Bank = (2 mm) = 30 = Lead-Free = (3.50 = Tape & Reel per wafer .0787 (0.76 m) Solder Charge mm) 03 (NVAM only) Gold on .138 DIA 2 FR contact area, Polyimide NVAF = 2 Banks = Full Reel 04 Matte Tin on film Pick & Socket 05.0 Tape & Reel solder tail Place Pad = (5 mm) (must order .1969 maximum quantity per reel contact Samtec A for quantity NVAM breaks) Board Mates: NVAF B C NO. OF LEAD NO. OF A B C BANKS STYLE ROWS (21.75) (5.46) (7.80) 1 02.0 02 .856 .215 .307 (37.75) (8.46) (9.60) 2 05.0 03 1.486 .333 .378 (11.40) 04 .449 View complete specifications at: samtec.com NVAM A NO. OF NVAF A BANKS Board Mates: (20.25) NVAM 1 .797 (36.25) 2 1.427 (4.80) NO. OF .189 B ROWS (6.00) B 02 .236 (7.80) 03 .307 (9.60) 04 .378 MATED HEIGHTS* AGGREGATE DATA RATE (NRZ) NVAM LEAD STYLE 448 672 896 1344 1792 Gbps Gbps Gbps Gbps Gbps NVAF LEAD STYLE -02.0 -05.0 1 Bank 2 Bank STACK INSULATOR CONTACT CURRENT WORKING LEAD-FREE 2 Row 3 Row 4 Row 2 Row 3 Row 4 Row TOTAL PAIRS PLATING -05.0 (7.00) .276 (10.00) .394 HEIGHTS MATERIAL MATERIAL RATING VOLTAGE SOLDERABLE 8 Pairs 12 Pairs 16 Pairs 24 Pairs 32 Pairs 2.1 A per pin *Processing conditions will affect mated height. (signal) Up to Au or Sn over 7 mm & 10 mm Black LCP Copper Alloy 200 VAC Yes Notes: 32 pairs 50 (1.27 m) Ni 9.6 A per pin Some sizes, styles and (ground) options are non-standard, non-returnable View complete specifications at: samtec.com NVAF F-221 (Rev 21DEC21) samtec.com/NovaRay Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtecs specifications which are subject to change without notice. PRELIMINARY PRELIMINARY