L6747ATR STMicroelectronics

L6747A High current MOSFET driver Features Dual MOSFET driver for synchronous rectified converters High driving current for fast external MOSFET switching Integrated bootstrap diode VFDFPN8 3x3 mm High frequency operation regulator solutions for modern high-current CPUs Enable pin and for DC-DC conversion in general. Adaptive dead-time management The L6747A embeds high-current drivers for both Flexible gate-drive: 5 V to 12 V compatible high-side and low-side MOSFETS. The device High-impedance (HiZ) management for output accepts a flexible power supply of 5 V to 12 V. stage shutdown This allows optimization of the high-side and low- side gate-drive voltage to maximize system effi- Preliminary overvoltage (OV) protection ciency. VFDFPN8 3x3 mm package The embedded bootstrap diode eliminates the need for external diodes. Anti shoot-through man- Applications agement prevents the high-side and low-side MOSFETs from conducting simultaneously and, High current VRM / VRD for desktop / server / combined with adaptive dead-time control, mini- workstation CPUs mizes the LS body diode conduction time. High current and high efficiency DC-DC The L6747A features preliminary OV protection to converters protect the load from dangerous overvoltage due to MOSFET failures at startup. Description The L6747A device is available in a VFDFPN8 The L6747A is a flexible, high-frequency dual- 3x3 mm package. driver specifically designed to drive N-channel MOSFETs connected in synchronous-rectified buck topology. Combined with ST PWM controllers, the driver allows the implementation of complete voltage Table 1. Device summary Order code Package Packing L6747A VFDFPN8 Tube L6747ATR VFDFPN8 Tape and reel March 2010 Doc ID 17126 Rev 1 1/15 www.st.com 15Contents L6747A Contents 1 Typical application circuit and block diagram 3 2 Pin information and thermal data 4 2.1 Pin information 4 2.2 Thermal data . 5 3 Electrical specifications 6 3.1 Absolute maximum ratings . 6 3.2 Electrical characteristics . 6 4 Device description and operation 8 4.1 High-impedance (HiZ) management . 9 4.2 Preliminary OV protection . 9 4.3 BOOT capacitance design . 9 4.4 Power dissipation . 10 4.5 Layout guidelines . 11 5 Package mechanical data 13 6 Revision history . 14 2/15 Doc ID 17126 Rev 1