STEVAL-BFA001V2B Data brief Multi-sensor predictive maintenance kit with IO-Link stack v.1.1 Features Kit content: Sensor node (marked STEVAL-IDP005V2 not available for separate sale) Communication adapter board (marked STEVAL-UKI001V2 not available for separate sale) STLINK-V3MINI programming and debugging interface Cables and connector Main supply voltage: 18 - 32 V Main components of the sensor node: 32-bit ARM Cortex -M4 core for signal processing and analysis (STM32F469AI) Ultra-wide bandwidth (up to 6kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB) Absolute digital pressure sensor (LPS22HB) Relative humidity and temperature sensors (HTS221) Digital microphone sensors (IMP34DT05) IO-Link PHY device (L6362A) EEPROM (M95M01-DF) for data storage Step-down switching regulator and LDO regulator (L6984 and LDK220) ESD protection (ESDALC6V1-1U2, SMBJ33CA) Complete set of firmware demo examples based on 3D accelerometer library with advanced frequency and time domain signal processing for predictive Product summary maintenance, including: Multi sensor predictive Programmable FFT size (256, 512, 1024, 2048), overlapping and averaging maintenance kit with STEVAL- Programmable windowing (Flat Top, Hanning, Hamming, Rectangular) embedded IO-Link BFA001V2B Speed RMS moving average, acceleration max. peak stack v.1.1 Programmable threshold for warning and alarm conditions in spectral band High-performance advanced line, ARM Microphone algorithms for: Cortex-M4 core with PDM to PCM DSP and FPU, 2 STM32F469AI Sound pressure level (SPL) Mbytes Flash, 384+4 kB of RAM, DMA Audio FFT controller, up to 17 IO-Link device stack v1.1 protocol and IO-Link Device Descriptor (IODD) for all timers measurements included (provided by TEConcept GmbH) Ultra-wide bandwidth, M12 standard industrial connector low-noise 3-axis digital IIS3DWB accelerometer for SWD connector for debugging and programming capability industrial applications Reset button IO-Link communication Expansion connector with GPIO, ADC, IC bus, timer L6362A transceiver device Designed to meet IEC industrial standard requirements Compact in-circuit debugger and STLINK-V3MINI programmer for STM32 Description Software package for The STEVAL-BFA001V2B is an industrial reference design kit for condition STSW- STEVAL-BFA001V2B monitoring (CM) and predictive maintenance (PdM), in a layout that is designed to BFA001V2 evaluation kit meet IEC61000-4-2/4 and EN60947 requirements for industrial applications. DB4059 - Rev 2 - April 2020 www.st.com For further information contact your local STMicroelectronics sales office.STEVAL-BFA001V2B The hardware consists of a highly compact (50 x 9 x 9 mm) industrial sensor board Product summary specifically designed for real industrial applications, and the necessary debugging Condition tools, cables, plugs and adapters for an industrial communications scenario. The monitoring and connection is managed using a standard multipolar cable with one wire used for IO- predictive Applications Link data. maintenance The STSW-BFA001V2 firmware package (freely available on www.st.com) includes Smart industry dedicated algorithms for advanced time and frequency domain signal processing and analysis of the high bandwidth 3D digital accelerometer for vibration monitoring. The package includes pressure, relative humidity and temperature sensor monitoring samples as well as audio algorithms for acoustic emission (AE). The firmware runs on the high performance STM32F469AI, ARM Cortex -M4, 32- bit microcontroller. The sensor data analysis results can be displayed on a user PC terminal emulator via wired connectivity or the related IO-Link master board interface. IO-Link device stack v1.1. (for evaluation purposes, with some limitations) is included in object library format with IO-Link Device Descriptor (IODD) for all measurements and with dedicated examples to demonstrate device interoperability with any master tool. It supports BLOB transfer for vibration and acoustic FFT data, event generator and parameter configuration. The package includes a GUI to demonstrate the IO-Link device features when connected to the STEVAL-IDP004V2 multi-port master evaluation board. DB4059 - Rev 2 page 2/13