STSAFA110S8SPL02

STSAFE-A110 Authentication, state-of-the-art security for peripherals and IoT devices Datasheet - production data CC EAL5+ AVA VAN5 Common Criteria certified Active shield Monitoring of environmental parameters UFDFPN8 Protection mechanism against faults (2 3 mm) SO8N (4 5 mm) Protection against side-channel attacks Advanced asymmetric cryptography Elliptic curve cryptography (ECC) with Features NIST or Brainpool 256-bit and 384-bit curves Authentication for: Elliptic curve digital signature algorithm Consumables and peripherals (ECDSA) with SHA-256 and SHA-384 for eCloud Internet of things (IoT) connected digital signature generation and verification objects Elliptic curve Diffie-Hellman (ECDH) for key USB Type-C power delivery chargers establishment Qi over-the-air chargers Advanced symmetric cryptography Secure channel establishment with remote Secure operating system with protection host including transport layer security (TLS) against logical and physical attacks handshake Secure operating system Signature verification service (secure boot and Secure STSAFE-A110 kernel for firmware upgrade) authentication and data management Usage monitoring with secure counters Protection against logical and physical Pairing and secure channel with host attacks application processor Hardware features Wrapping and unwrapping of local host envelopes 6 Kbytes of configurable non-volatile memory Symmetric data encryption or decryption (up to Highly reliable CMOS EEPROM 16 keys) technology On-chip key pair generation 30 years data retention at 25 C 500 000 erase / program cycles endurance LPWAN security ready: at 25 C Preloading with Sigfox or LoRaWAN 1.62 V to 5.5 V continuous supply voltage credentials Frame signature and verification Operating temperature: 40 to 105 C Frame encryption and decryption Security features Latest generation of highly secure MCUs Unique serial number on each die December 2019 DS13039 Rev 1 1/36 This is information on a product in full production. www.st.comSTSAFE-A110 Protocol IC-bus slave interface Up to 400 kbps transmission speed (Fast mode) and true open-drain pads 7-bit addressing Packages ECOPACK-compliant SO8N 8-lead plastic small outline and UFDFPN 8-lead ultra thin profile fine pitch dual flat packages 2/36 DS13039 Rev 1