TS2007EIJT STMicroelectronics

TS2007FC 3 W, filter-free, class-D audio power amplifier with 6 or 12 dB fixed gain select Datasheet - production data Description TS2007EIJT, 9-bump Flip-chip The TS2007FC is a class-D audio power amplifier. It is able to drive up to 1.4 W into an 8 load at 5 V, it achieves better efficiency than typical class-AB audio power amplifiers. This device can switch between two gain settings, 6 dB or 12 dB via a logic signal on the gain select pin. The pop and click reduction circuitry provides low on/off switching noise which allows the device to start within 1 ms typically. A standby mode function (active low) keeps the Features current consumption down to 1 A typically. Operates from V = 2.4 V to 5.5 V CC The TS2007FC is available in a 9-bump Flip-chip Standby mode active low lead-free package. Output power: 1.4 W at 5 V or 0.5 W at 3.0 V into 8 with 1% THD+N max. Output power: 2.3 W at 5 V or 0.75 W at 3.0 V into 4 with 1% THD+N max. Two fixed gain selects: 6 dB or 12 dB Low current consumption Efficiency: 86% typ. Signal-to-noise ratio: 90 dB typ. PSRR: 68 dB typical at 217 Hz with 6 dB gain PWM base frequency: 280 kHz Low pop and click noise Thermal shutdown protection Output short-circuit protection Flip-chip lead-free 9-bump package with back coating in option Applications Cellular phones PDAs Notebook PCs April 2019 DocID14937 Rev 4 1/33 This is information on a product in full production. www.st.comContents TS2007FC Contents 1 Absolute maximum ratings and operating conditions . 4 2 Application information 6 3 Electrical characteristics . 8 3.1 Electrical characteristics tables . 8 3.2 Electrical characteristic curves . 13 4 Application information . 22 4.1 Differential configuration principle 22 4.2 Gain settings 22 4.3 Common mode feedback loop limitations 22 4.4 Low frequency response . 23 4.5 Circuit decoupling . 23 4.6 Wakeup time (t ) 24 wu 4.7 Shutdown time . 24 4.8 Consumption in shutdown mode . 24 4.9 Single-ended input configuration . 24 4.10 Output filter considerations 25 4.11 Short-circuit protection . 27 4.12 Thermal shutdown 27 5 Package information 28 5.1 9-bump Flip-chip package information . 29 6 Ordering information . 30 7 Revision history . 30 2/33 DocID14937 Rev 4