VNQ830ETR-E STMicroelectronics

VNQ830E-E Quad channel high-side driver Features Type R I V DS(on) OUT CC (1) (1) VNQ830E-E 65 m 9.5 A 36 V 1. Per each channel. Output current: 9.5 A SO-28 (double island) CMOS compatible inputs On-state open-load detection Description Off-state open-load detection The VNQ830E-E is a quad HSD formed by Output stuck to V detection assembling two VND830E-E chips in the same CC SO-28 package. The VND830E-E is a monolithic Open drain status outputs device made using STMicroelectronics Undervoltage shutdown VIPower M0-3 technology. Overvoltage clamp It is intended for driving resistive or inductive Thermal shutdown loads with one side connected to ground. Active Current and power limitation V pin voltage clamp protects the device against CC low energy spikes (see ISO7637 transient Very low standby current compatibility table). Protection against loss of ground and loss of The device detects open-load condition both in V CC on-state and off-state. Output shorted to V is CC Reverse battery protection detected in the off-state. Output current limitation Very low electromagnetic susceptibility protects the device in overload condition. In case of long duration overload, the device limits the Optimized electromagnetic emission dissipated power to safe level up to thermal shutdown intervention. Thermal shutdown with automatic restart allows the device to recover normal operation as soon as fault condition disappears. Table 1. Device summary Order codes Package Tube Tape and reel SO-28 VNQ830E-E VNQ830ETR-E May 2010 Doc ID 17459 Rev 1 1/28 www.st.com 1 Obsolete Product(s) - Obsolete Product(s)VNQ830E-E Contents Contents 1 Block diagram and pin description . 5 2 Electrical specifications 7 2.1 Absolute maximum ratings . 7 2.2 Thermal data . 8 2.3 Electrical characteristics . 8 2.4 Electrical characteristics curves 15 3 Application information . 18 3.1 GND protection network against reverse battery . 18 3.1.1 Solution 1: a resistor in the ground line (RGND only) 18 3.1.2 Solution 2: a diode (D ) in the ground line 19 GND 3.2 Load dump protection 19 3.3 MCU I/O protection 19 3.4 Open-load detection in off-state 20 3.5 Maximum demagnetization energy . 21 4 Package and PCB thermal data . 22 4.1 SO-28 thermal data . 22 5 Package and packing information . 25 5.1 ECOPACK packages . 25 5.2 SO-28 packing information 26 6 Revision history . 27 Doc ID 17459 Rev 1 2/28 Obsolete Product(s) - Obsolete Product(s)