1SS355 RRG

1SS355 Taiwan Semiconductor Small Signal Product 200mW High Speed SMD Switching Diode FEATURES - Fast switching device (trr<4.0ns) - Surface Mount Device Type - Moisture sensitivity level 1 - Matte Tin (Sn) lead finish with Nickel (Ni) underplate - Pb free version and RoHS compliant - Packing code with suffix means green compound (halogen-free) SOD-323F MECHANICAL DATA - Case: Flat lead SOD-323F small outline plastic package - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed: 260C/10s - Polarity: Indicated by cathode band - Weight: 6 0.5mg - Marking code: S4 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T =25 unless otherwise noted) A PARAMETER VALUE SYMBOL UNIT Power Dissipation P 200 mW D Repetitive Peak Reverse Voltage V 90 V RRM Reverse Voltage V 80 V R Minimum Breakdown Voltage at I = 100A V 80 R V BR Forward Current I 250 mA F Continue Forward Current I 150 mA O Repetitive Peak Forward Voltage I 500 mA FSM Maximum Reverse Leakage Current at V = 80V I 100 nA R R Maximum Forward Voltage at I = 100mA V 1.2 V F F Maximum Reverse Recovery Time t 4 ns rr at I = 10mA, V = 6V, R = 100 Ohms F R L Maximum Junction Capacitance at V = 0.5V, f = 1MHz C 4 pF R j o OperatingTemperature Range T - 65 to +150 OPR C o Storage Temperature Range T - 65 to +150 C STG Note : These ratings are limiting values above which the serviceability of the diode may be impaired Version: C16031SS355 Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PACKING CODE PART NO. PART NO. PACKING CODE PACKAGE PACKING SUFFIX SUFFIX RR 3K / 7 Reel -xx 1SS355 G SOD-323F (Note 1) R9 10K / 13 Reel Note 1: Part No. Suffix -xx would be used for special requirement EXAMPLE PART NO. PACKING CODE PREFERRED P/N PACKING CODE DESCRIPTION PART NO. SUFFIX SUFFIX Multiple manufacture 1SS355 RRG 1SS355 RR G source Green compound Defined manufacture 1SS355-L0 RRG 1SS355 -L0 RR G source Green compound Defined manufacture 1SS355-B0 RRG 1SS355 -B0 RR G source Green compound PACKAGE OUTLINE DIMENSIONS SOD-323F Unit (mm) Unit (inch) DIM. Min Max Min Max A 1.15 1.35 0.045 0.053 B 2.30 2.80 0.091 0.110 C 0.25 0.40 0.010 0.016 D 1.60 1.80 0.063 0.071 E 0.80 1.10 0.031 0.043 F 0.05 0.25 0.002 0.010 SUGGEST PAD LAYOUT Unit (mm) Unit (inch) DIM. Typ. Typ. 0.630 0.025 A 0.830 0.033 B C 1.600 0.063 2.860 0.113 D Version: C1603