Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) December 2015 Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) Bluetooth V4.1 Smart (Low Energy) Single Mode Module SESUB-PAN-D14580(2/4) Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) Bluetooth V4.1 Smart (Low Energy) Single Mode Module Overview of SESUB-PAN-D14580 FEATURES Ultra small package - Ideal for for wearable devices Space saving Ultra small package 3.5 x 3.5 x 1.0mm (TYP) Packaged in 36 pin solder bumped BGA with 0.5mm pitch Compatible with Bluetooth Smart Ready products ARM Cortex-M0 32bit high performance microcontroller 32kB OTP programmable memory, 84kB ROM for BT stack 42kB System SRAM, 8kB Retention SRAM Including IC (Dialog Semiconductor : DA14580), Crystal (16MHz), Inductor, and Capacitor in this module. Space Saving 83% 3.5mm 0.5mm pitch Solder Bumped BGA 8.5mm 36pins Discrete Solution SESUB-PAN-D14580 2 2 72.3mm 12.3mm APPLICATION Healthcare/sports & fitness equipment (Example: Activity mass meter, thermometer, sphygmomanometer, blood oximeter, blood glucose meter, heart rate meter, biometrics) Wearable devices (Example: Wristband, watch, ring, glasses, shoes, hat, shirt) Home entertainment equipment (Example: Remote control, sensor tag, toys, lighting products) PC peripheral applications (Example: Mouse, key board, stylus, presentation pointer Bluetooth and Bluetooth Low Energy are the standards established by Bluetooth Special Interest Group (SIG). Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. For product inquiries: SESUB Support tdk.co.jp 20151201 / sesub-pan-d14580 en.fm 8.5mm 3.5mm