Product Information

TK11A50D(STA4,Q,M)

TK11A50D(STA4,Q,M) electronic component of Toshiba

Datasheet
Toshiba MOSFET N-Ch 500V FET Vgss 30V 45W .45 ohm

Manufacturer: Toshiba
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.9633 ea
Line Total: USD 2.96

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 28 May to Thu. 30 May

MOQ : 1
Multiples : 1
1 : USD 2.024
10 : USD 1.725
100 : USD 1.403
250 : USD 1.3455
500 : USD 1.2075
1000 : USD 1.043
5000 : USD 1.035
10000 : USD 1.0016

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Brand
Factory Pack Quantity :
Configuration
Height
Length
Series
Transistor Type
Width
Cnhts
Hts Code
Mxhts
Product Type
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Taric
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TK11A50D TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (-MOS) TK11A50D Switching Regulator Applications Unit: mm 2.7 0.2 10 0.3 3.2 0.2 A Low drain-source ON-resistance: R = 0.45 (typ.) DS (ON) High forward transfer admittance: Y = 5.5 S (typ.) fs Low leakage current: I = 10 A (max) (V = 500 V) DSS DS Enhancement mode: V = 2.0 to 4.0 V (V = 10 V, I = 1 mA) th DS D 1.14 0.15 0.69 0.15 Absolute Maximum Ratings (Ta = 25C) M A 0.2 2.54 2.54 Characteristics Symbol Rating Unit 1 2 3 Drain-source voltage V 500 V DSS Gate-source voltage V 30 V GSS DC (Note 1) I 11 D 1: Gate Drain current A 2: Drain Pulse (t = 1 ms) I 44 DP 3: Source (Note 1) Drain power dissipation (Tc = 25C) P 45 W D JEDEC Single pulse avalanche energy E 264 mJ AS JEITA SC-67 (Note 2) Avalanche current I 11 A TOSHIBA 2-10U1B AR Repetitive avalanche energy (Note 3) E 4.5 mJ AR Weight: 1.7 g (typ.) Channel temperature T 150 C ch Storage temperature range T 55 to 150 C stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics 2 Characteristics Symbol Max Unit Thermal resistance, channel to case R 2.78 C/W th (ch-c) Thermal resistance, channel to ambient R 62.5 C/W th (ch-a) 1 Note 1: Ensure that the channel temperature does not exceed 150. Note 2: V = 90 V, T = 25C(initial), L = 3.7 mH, R = 25 , I = 11 A DD ch G AR Note 3: Repetitive rating: pulse width limited by maximum channel temperature 3 This transistor is an electrostatic-sensitive device. Handle with care. Start of commercial production 2009-05 1 2013-11-01 0.64 0.15 2.6 0.1 3.9 3.0 2.8 MAX. 13 0.5 15.0 0.3 4.5 0.2 TK11A50D Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. MaxUnit Gate leakage current I V = 30 V, V = 0 V 1 A GSS GS DS Drain cut-off current I V = 500 V, V = 0 V 10 A DSS DS GS Drain-source breakdown voltage V I = 10 mA, V = 0 V 500 V (BR) DSS D GS Gate threshold voltage V V = 10 V, I = 1 mA 2.0 4.0 V th DS D Drain-source ON-resistance R V = 10 V, I = 5.5 A 0.45 0.6 DS (ON) GS D Forward transfer admittance Y V = 10 V, I = 5.5 A 1.4 5.5 S fs DS D Input capacitance C 1200 iss V = 25 V, V = 0 V, f = 1 MHz pF Reverse transfer capacitance C 6 rss DS GS Output capacitance C 120 oss Rise time t 25 10 V I = 5.5 A V r D OUT V GS 0 V Turn-on time t 60 on R = 36 L 50 Switching time ns Fall time t 12 f V 200 V DD Turn-off time t 100 off Duty 1%, t = 10 s w Total gate charge Q 24 g V 400 V, V = 10 V, I = 11 A 16 nC Gate-source charge Q gs DD GS D Gate-drain charge Q 8 gd Source-Drain Ratings and Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. MaxUnit Continuous drain reverse current (Note 1) I 11 A DR Pulse drain reverse current (Note 1) I 44 A DRP Forward voltage (diode) V I = 11 A, V = 0 V 1.7 V DSF DR GS Reverse recovery time t I = 11 A, V = 0 V, 1300 ns rr DR GS dI /dt = 100 A/s Reverse recovery charge Q 12 C rr DR Marking Note 4 : A line under a Lot No. identifies the indication of product Labels G /RoHS COMPATIBLE or G /RoHS Pb Please contact your TOSHIBA sales representative for details as to Part No. environmental matters such as the RoHS compatibility of Product. (or abbreviation code) The RoHS is Directive 2011/65/EU of the European Parliament and K11A50D Lot No. of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Note 4 2 2013-11-01

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES,
Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
TS4

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