X-On Electronics has gained recognition as a prominent supplier of TE0711-01-100-2I System-On-Modules - SOM across the USA, India, Europe, Australia, and various other global locations. TE0711-01-100-2I System-On-Modules - SOM are a product manufactured by Trenz Electronic. We provide cost-effective solutions for System-On-Modules - SOM, ensuring timely deliveries around the world.
We are delighted to provide the TE0711-01-100-2I from our System-On-Modules - SOM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TE0711-01-100-2I and other electronic components in the System-On-Modules - SOM category and beyond.
TE0711 TRM Revision v.35 Exported on 2019-02-21 Online version of this document: TE0711 TRM Revision: v.35 1 Table of Contents 1 Table of Contents................................................................................................................................................... 2 2 Table of Figures...................................................................................................................................................... 4 3 Table of Tables ....................................................................................................................................................... 5 4 Overview................................................................................................................................................................. 6 4.1 Key Features........................................................................................................................................................... 6 4.2 Block Diagram ........................................................................................................................................................ 7 4.3 Main Components.................................................................................................................................................. 8 4.4 Initial Delivery State............................................................................................................................................... 9 5 Signals, Interfaces and Pins................................................................................................................................. 10 5.1 Board to Board (B2B) I/Os ................................................................................................................................... 10 5.2 JTAG Interface...................................................................................................................................................... 10 5.3 System Controller I/O Pins .................................................................................................................................. 11 5.4 On-board LEDs ..................................................................................................................................................... 11 5.5 Clocking ................................................................................................................................................................ 12 6 On-board Peripherals .......................................................................................................................................... 13 6.1 32 MByte Quad SPI Flash Memory....................................................................................................................... 13 6.2 System Controller CPLD ...................................................................................................................................... 13 6.3 Dual channel USB to UART/FIFO ......................................................................................................................... 13 7 Power and Power-On Sequence ......................................................................................................................... 14 7.1 Power Supply ....................................................................................................................................................... 14 7.2 Power-On Sequence ............................................................................................................................................ 14 7.3 Power Rails........................................................................................................................................................... 15 7.4 Bank Voltages....................................................................................................................................................... 15 8 Board to Board Connectors................................................................................................................................. 16 8.1 Connector Mating height ..................................................................................................................................... 16 8.2 Connector Speed Ratings .................................................................................................................................... 17 8.3 Current Rating ...................................................................................................................................................... 17 8.4 Connector Mechanical Ratings............................................................................................................................ 17 9 Variants Currently In Production ........................................................................................................................ 18 10 Technical Specifications...................................................................................................................................... 19 10.1 Absolute Maximum Ratings................................................................................................................................. 19 10.2 Recommended Operating Conditions ................................................................................................................ 19 10.3 Operating Temperature Ranges.......................................................................................................................... 20 10.4 Physical Dimensions ............................................................................................................................................ 20 10.5 Weight................................................................................................................................................................... 21 Copyright 2019Trenz 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