6.15 mm SQJA82EP www.vishay.com Vishay Siliconix Automotive N-Channel 80 V (D-S) 175 C MOSFET FEATURES PowerPAK SO-8L Single TrenchFET power MOSFET AEC-Q101 qualified 100 % R and UIS tested g D Material categorization: for definitions of compliance please see 1 S www.vishay.com/doc 99912 2 S 3 S 4 D 1 G Top View Bottom View PRODUCT SUMMARY V (V) 80 DS G R ( ) at V = 10 V 0.0082 DS(on) GS R ( ) at V = 4.5 V 0.0112 DS(on) GS I (A) 60 N-Channel MOSFET D Configuration Single S Package PowerPAK SO-8L ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOLLIMITUNIT Drain-Source Voltage V 80 DS V Gate-Source Voltage V 20 GS a T = 25 C 60 C Continuous Drain Current I D T = 125 C 36 C a Continuous Source Current (Diode Conduction) I 60 A S b Pulsed Drain Current I 120 DM Single Pulse Avalanche Current I 35 AS L = 0.1 mH Single Pulse Avalanche Energy E 62 mJ AS T = 25 C 68 C b Maximum Power Dissipation P W D T = 125 C 22 C Operating Junction and Storage Temperature Range T , T -55 to +175 J stg C d, e Soldering Recommendations (Peak Temperature) 260 THERMAL RESISTANCE RATINGS PARAMETER SYMBOLLIMITUNIT c Junction-to-Ambient PCB Mount R 68 thJA C/W Junction-to-Case (Drain) R 2.2 thJC Notes a. Package limited. b. Pulse test pulse width 300 s, duty cycle 2 %. c. When mounted on 1 square PCB (FR4 material). d. See solder profile (www.vishay.com/doc 73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components. S16-2144-Rev. A, 17-Oct-16 Document Number: 75101 1 For technical questions, contact: automostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 5.13 mmSQJA82EP www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOLTEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-Source Breakdown Voltage V V = 0, I = 250 A 80 - - DS GS D V Gate-Source Threshold Voltage V V = V , I = 250 A 1.5 2.0 2.5 GS(th) DS GS D Gate-Source Leakage I V = 0 V, V = 20 V - - 100 nA GSS DS GS V = 0 V V = 80 V - - 1 GS DS Zero Gate Voltage Drain Current I V = 0 V V = 80 V, T = 125 C - - 50 A DSS GS DS J V = 0 V V = 80 V, T = 175 C - - 250 GS DS J a On-State Drain Current I V = 10 V V 5 V 30 - - A D(on) GS DS V = 10 V I = 10 A - 0.0068 0.0082 GS D V = 4.5 V I = 8 A - 0.0093 0.0112 GS D a Drain-Source On-State Resistance R DS(on) V = 10 V I = 10 A, T = 125 C - - 0.0134 GS D J V = 10 V I = 10 A, T = 175 C - - 0.0170 GS D J b Forward Transconductance g V = 15 V, I = 10 A - 53 - S fs DS D b Dynamic Input Capacitance C - 2280 3000 iss Output Capacitance C -V = 0 V V = 25 V, f = 1 MHz10201400 pF oss GS DS Reverse Transfer Capacitance C -3045 rss c Total Gate Charge Q -40 60 g c Gate-Source Charge Q -8V = 10 V V = 40 V, I = 5 A.5- nC gs GS DS D c Gate-Drain Charge Q -5.5- gd Gate Resistance R f = 1 MHz 0.2 0.43 0.65 g c Turn-On Delay Time t -14 25 d(on) c Rise Time t -5 10 r V = 40 V, R = 8 DD L ns I 5 A, V = 10 V, R = 1 c D GEN g Turn-Off Delay Time t -2640 d(off) c Fall Time t -1325 f b Source-Drain Diode Ratings and Characteristics a Pulsed Current I -- 120 A SM Forward Voltage V I = 10 A, V = 0 - 0.81 1.2 V SD F GS Body diode reverse recovery time t - 54 110 ns rr Body diode reverse recovery charge Q -80 160 nC rr I = 10 A, di/dt = 100 A/s F Reverse recovery fall time t -26 - a ns Reverse recovery rise time t -28 - b Body diode peak reverse recovery current I --2.7 -6 A RM(REC) Notes a. Pulse test pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S16-2144-Rev. A, 17-Oct-16 Document Number: 75101 2 For technical questions, contact: automostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000