Product Information

VS-HFA08TB60HN3

VS-HFA08TB60HN3 electronic component of Vishay

Datasheet
Rectifiers Hexfreds - TO-220-e3

Manufacturer: Vishay
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.343 ea
Line Total: USD 2.34

1248 - Global Stock
Ships to you between
Mon. 03 Jun to Wed. 05 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
881 - WHS 1


Ships to you between Mon. 03 Jun to Wed. 05 Jun

MOQ : 1
Multiples : 1
1 : USD 1.6373
10 : USD 1.4713
100 : USD 1.1414
500 : USD 0.9433
1000 : USD 0.6882

     
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VS-HFA08TB60HN3 www.vishay.com Vishay Semiconductors HEXFRED Ultrafast Soft Recovery Diode, 8 A FEATURES Ultrafast and ultrasoft recovery Very low I and Q RRM rr AEC-Q101 qualified meets JESD 201 class 2 2 whisker test Material categorization: 3 for definitions of compliance please see 1 TO-220AC www.vishay.com/doc 99912 BENEFITS Base cathode Reduced RFI and EMI 2 Reduced power loss in diode and switching transistor Higher frequency operation Reduced snubbing Reduced parts count 1 3 Cathode Anode DESCRIPTION VS-HFA08TB60... is a state of the art ultrafast recovery diode. Employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance PRODUCT SUMMARY which is unsurpassed by any rectifier previously available. With basic ratings of 600 V and 8 A continuous current, the Package TO-220AC VS-HFA08TB60... is especially well suited for use as the I 8 A F(AV) companion diode for IGBTs and MOSFETs. In addition to V 600 V R ultrafast recovery time, the HEXFRED product line features V at I 1.4 V extremely low values of peak recovery current (I ) and F F RRM does not exhibit any tendency to snap-off during the t b t typ. 18 ns rr portion of recovery. The HEXFRED features combine to offer T max. 150 C J designers a rectifier with lower noise and significantly lower Diode variation Single die switching losses in both the diode and the switching transistor. These HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. The HEXFRED VS-HFA08TB60... is ideally suited for applications in power supplies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed. ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOLTEST CONDITIONSVALUESUNITS Cathode to anode voltage V 600 V R Maximum continuous forward current I T = 100 C 8 F C Single pulse forward current I 60 A FSM Maximum repetitive forward current I 24 FRM T = 25 C 36 C Maximum power dissipation P W D T = 100 C 14 C Operating junction and storage temperature range T , T -55 to +150 C J Stg Revision: 15-Jul-15 Document Number: 94970 1 For technical questions within your region: DiodesAmericas vishay.com, DiodesAsia vishay.com, DiodesEurope vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000VS-HFA08TB60HN3 www.vishay.com Vishay Semiconductors ELECTRICAL SPECIFICATIONS (T = 25 C unless otherwise specified) J PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Cathode to anode V I = 100 A 600 - - BR R breakdown voltage I = 8.0 A -1.4 1.7 F V Maximum forward voltage V I = 16 A See fig. 1 - 1.7 2.1 FM F I = 8.0 A, T = 125 C - 1.4 1.7 F J -0.3 5.0 V = V rated Maximum reverse R R I See fig. 2 A RM leakage current T = 125 C, V = 0.8 x V rated J R R - 100 500 Junction capacitance C V = 200 V See fig. 3 - 10 25 pF T R Series inductance L Measured lead to lead 5 mm from package body - 8.0 - nH S DYNAMIC RECOVERY CHARACTERISTICS (T = 25 C unless otherwise specified) J PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS t I = 1.0 A, dI /dt = 200 A/s, V = 30 V - 18 - rr F F R Reverse recovery time t T = 25 C -37- ns rr1 J t T = 125 C - 55 - rr2 J I T = 25 C - 3.5 - RRM1 J Peak recovery current A I = 8.0 A I T = 125 C F - 4.5 - RRM2 J dI /dt = 200 A/s F Q T = 25 C - 65 - rr1 J V = 200 V R Reverse recovery charge nC Q T = 125 C - 124 - rr2 J dI /dt1 T = 25 C - 240 - (rec)M J Peak rate of fall of A/s recovery current during t b dI /dt2 T = 125 C - 210 - (rec)M J THERMAL - MECHANICAL SPECIFICATIONS PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Lead temperature T 0.063 from case (1.6 mm) for 10 s - - 300 C lead Thermal resistance, R --3.5 thJC junction to case Thermal resistance, R Typical socket mount - - 80 K/W thJA junction to ambient Thermal resistance, R Mounting surface, flat, smooth and greased - 0.5 - thCS case to heatsink -2.0 - g Weight -0.07 - oz. 6.0 12 kgf cm Mounting torque - (5.0) (10) (lbf in) Marking device Case style TO-220AC HFA08TB60H Revision: 15-Jul-15 Document Number: 94970 2 For technical questions within your region: DiodesAmericas vishay.com, DiodesAsia vishay.com, DiodesEurope vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000

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8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free
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