HSF-48-30-B-F Wakefield

HSF-48-30-B-F electronic component of Wakefield
HSF-48-30-B-F Wakefield
HSF-48-30-B-F Heat Sinks
HSF-48-30-B-F  Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of HSF-48-30-B-F Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSF-48-30-B-F Heat Sinks are a product manufactured by Wakefield. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. HSF-48-30-B-F
Manufacturer: Wakefield
Category: Heat Sinks
Description: Heat Sinks Heatsink Fan Combination 47.5x47.5mm 5.9CFM 29.5mm Height 0.83 CW
Datasheet: HSF-48-30-B-F Datasheet (PDF)
Price (USD)
100: USD 40.9563 ea
Line Total: USD 4095.63 
Availability : 0
  
QtyUnit Price
100$ 40.9563

Availability 0
Ship by Wed. 13 Aug to Fri. 15 Aug
MOQ : 100
Multiples : 100
QtyUnit Price
100$ 40.9563


Availability 0
Ship by Wed. 13 Aug to Fri. 15 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 63.0603

   
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RoHS - XON
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We are delighted to provide the HSF-48-30-B-F from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSF-48-30-B-F and other electronic components in the Heat Sinks category and beyond.

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Heat Sink Fan Combinations HSF Series Wakefield-Vettes Heat Sink Fan Series (HSF) are for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, Cloud Computing, and many more Industries. Material: AL 6063 Finish: Black Anodize Series- Chip Size- Height- Chip Height- Fan 48 B-Blue (2.2-3.4mm) F (Fan) HSF mm 50 Y- Yellow (.9-2.1mm) N (No Fan) 55 WKV Part Number Chip Size Height (mm) C/W Chip Height Fan HSF-48-19-B-F 47.5 x 47.5mm 18.5 1.41 2.2-3.4mm 5.9CFM HSF-48-19-Y-F 47.5 x 47.5mm 18.5 1.41 .9-2.1mm 5.9CFM HSF-48-22-B-F 47.5 x 47.5mm 21.5 1.14 2.2-3.4mm 5.9CFM HSF-48-22-Y-F 47.5 x 47.5mm 21.5 1.14 .9-2.1mm 5.9CFM HSF-48-25-B-F 47.5 x 47.5mm 24.5 0.98 2.2-3.4mm 5.9CFM HSF-48-25-Y-F 47.5 x 47.5mm 24.5 0.98 .9-2.1mm 5.9CFM HSF-48-28-B-F 47.5 x 47.5mm 27.5 0.88 2.2-3.4mm 5.9CFM HSF-48-28-Y-F 47.5 x 47.5mm 27.5 0.88 .9-2.1mm 5.9CFM HSF-48-30-B-F 47.5 x 47.5mm 29.5 0.83 2.2-3.4mm 5.9CFM HSF-48-30-Y-F 47.5 x 47.5mm 29.5 0.83 .9-2.1mm 5.9CFM HSF-48-35-B-F 47.5 x 47.5mm 34.5 0.77 2.2-3.4mm 5.9CFM HSF-48-35-Y-F 47.5 x 47.5mm 34.5 0.77 .9-2.1mm 5.9CFM HSF-48-40-B-F 47.5 x 47.5mm 39.5 0.72 2.2-3.4mm 5.9CFM HSF-48-40-Y-F 47.5 x 47.5mm 39.5 0.72 .9-2.1mm 5.9CFM HSF-50-19-B-F 50 x 50mm 18.5 1.31 2.2-3.4mm 5.9CFM HSF-50-19-Y-F 50 x 50mm 18.5 1.31 .9-2.1mm 5.9CFM HSF-50-22-B-F 50 x 50mm 21.5 1.06 2.2-3.4mm 5.9CFM HSF-50-22-Y-F 50 x 50mm 21.5 1.06 .9-2.1mm 5.9CFM HSF-50-25-B-F 50 x 50mm 24.5 0.91 2.2-3.4mm 5.9CFM HSF-50-25-Y-F 50 x 50mm 24.5 0.91 .9-2.1mm 5.9CFM HSF-50-28-B-F 50 x 50mm 27.5 0.82 2.2-3.4mm 5.9CFM HSF-50-28-Y-F 50 x 50mm 27.5 0.82 .9-2.1mm 5.9CFM HSF-50-30-B-F 50 x 50mm 29.5 0.77 2.2-3.4mm 5.9CFM HSF-50-30-Y-F 50 x 50mm 29.5 0.77 .9-2.1mm 5.9CFM HSF-50-35-B-F 50 x 50mm 34.5 0.71 2.2-3.4mm 5.9CFM HSF-50-35-Y-F 50 x 50mm 34.5 0.71 .9-2.1mm 5.9CFM HSF-50-40-B-F 50 x 50mm 39.5 0.67 2.2-3.4mm 5.9CFM HSF-50-40-Y-F 50 x 50mm 39.5 0.67 .9-2.1mm 5.9CFM HSF-55-24-B-F 55 x 55mm 24.1 1 2.2-3.4mm 13.8CFM HSF-55-24-Y-F 55 x 55mm 24.1 1 .9-2.1mm 13.8CFM HSF-55-27-B-F 55 x 55mm 27.1 0.81 2.2-3.4mm 13.8CFM HSF-55-27-Y-F 55 x 55mm 27.1 0.81 .9-2.1mm 13.8CFM HSF-55-30-B-F 55 x 55mm 30.1 0.7 2.2-3.4mm 13.8CFM HSF-55-30-Y-F 55 x 55mm 30.1 0.7 .9-2.1mm 13.8CFM HSF-55-33-B-F 55 x 55mm 33.1 0.63 2.2-3.4mm 13.8CFM HSF-55-33-Y-F 55 x 55mm 33.1 0.63 .9-2.1mm 13.8CFM HSF-55-35-B-F 55 x 55mm 35.1 0.59 2.2-3.4mm 13.8CFM HSF-55-35-Y-F 55 x 55mm 35.1 0.59 .9-2.1mm 13.8CFM HSF-55-40-B-F 55 x 55mm 40.1 0.55 2.2-3.4mm 13.8CFM HSF-55-40-Y-F 55 x 55mm 40.1 0.55 .9-2.1mm 13.8CFM HSF-55-45-B-F 55 x 55mm 45.1 0.51 2.2-3.4mm 13.8CFM HSF-55-45-Y-F 55 x 55mm 45.1 0.51 .9-2.1mm 13.8CFM www.wakefield-vette.comHeat Sink Fan Combinations HSF Series Chip Size 47.5x 47.5mm Chip Size 50 x 50mm Chip Size 55 x 55mm

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
Wakefield Engineering
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WAKEFIELD THERMAL
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Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc
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