Product Information

W25Q10EWSNIG

W25Q10EWSNIG electronic component of Winbond

Datasheet
Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 1M-bit 8-bit 6ns 8-Pin SOIC Tube

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - Global Stock

MOQ : 100
Multiples : 1

Stock Image

W25Q10EWSNIG
Winbond

100 : USD 0.2788
N/A

Obsolete
0 - Global Stock

MOQ : 1700
Multiples : 1700

Stock Image

W25Q10EWSNIG
Winbond

1700 : USD 0.374
5100 : USD 0.3575
10200 : USD 0.3536
25500 : USD 0.3498
N/A

Obsolete
     
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Product Category
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Package / Case
Series
Memory Size
Maximum Clock Frequency
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Supply Voltage - Max
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W25Q10EW 1.8V 1M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS, DUAL AND QUAD SPI Publication Release Date: December 06, 2017 - 1 - Revision I W25Q10EW Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 5 2. FEATURES ................................................................................................................................. 5 4. PACKAGE TYPES AND PIN CONFIGURATIONS..................................................................... 6 4.1 Pin Configuration SOIC/VSOP 150-mil .......................................................................... 6 4.2 PAD Configuration USON 2x3-mm................................................................................. 6 4.3 Pin Description SOIC /VSOP 150-mil and USON 2x3-mm ............................................ 6 4.4 Ball Configuration WLCSP .............................................................................................. 7 4.5 Ball Description WLCSP ................................................................................................. 7 5. PIN DESCRIPTIONS .................................................................................................................. 8 5.1 Chip Select (/CS) ............................................................................................................ 8 5.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................... 8 5.3 Write Protect (/WP) ......................................................................................................... 8 5.4 HOLD (/HOLD)................................................................................................................ 8 5.5 Serial Clock (CLK) .......................................................................................................... 8 6. BLOCK DIAGRAM ...................................................................................................................... 9 7. FUNCTIONAL DESCRIPTION.................................................................................................. 10 7.1 SPI OPERATIONS ....................................................................................................... 10 7.1.1 Standard SPI Instructions ............................................................................................... 10 7.1.2 Dual SPI Instructions ...................................................................................................... 10 7.1.3 Quad SPI Instructions ..................................................................................................... 10 7.1.4 Hold Function .................................................................................................................. 10 7.2 WRITE PROTECTION .................................................................................................. 11 7.2.1 Write Protect Features .................................................................................................... 11 8. CONTROL AND STATUS REGISTERS ................................................................................... 12 8.1 STATUS REGISTER .................................................................................................... 12 8.1.1 BUSY .............................................................................................................................. 12 8.1.2 Write Enable Latch (WEL) .............................................................................................. 12 8.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 12 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 12 8.1.5 Sector/Block Protect (SEC) ............................................................................................. 12 8.1.6 Complement Protect (CMP) ............................................................................................ 12 8.1.7 Protection and Special One time Programming Setting(SRP and SRL) ......................... 13 8.1.8 Erase/Program Suspend Status (SUS) ........................................................................... 14 8.1.9 Security Register Lock Bits (LB 3:1 ) Volatile/Non-Volatile OTP Writable ................. 14 8.1.10 Quad Enable (QE) ........................................................................................................ 14 8.1.11 Status Register Memory Protection (CMP = 0) ............................................................. 15 8.1.12 Status Register Memory Protection (CMP = 1) ............................................................. 16 8.2 INSTRUCTIONS ........................................................................................................... 17 8.2.1 Manufacturer and Device Identification ........................................................................... 17 (1) 8.2.2 Instruction Set Table 1 (Erase, Program Instructions) ................................................. 18 8.2.3 Instruction Set Table 2 .................................................................................................... 18 8.2.4 Write Enable (06h) .......................................................................................................... 20 8.2.5 Write Enable for Volatile Status Register (50h) ............................................................... 21 Publication Release Date: December 06, 2017 - 2 - Revision I

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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