Product Information

W25Q128JVSIM

Hot W25Q128JVSIM electronic component of Winbond

Datasheet
FLASH - NOR Memory IC 128Mbit SPI - Quad I/O, QPI, DTR 133 MHz 8-SOIC

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.2805 ea
Line Total: USD 1.28

902 - Global Stock
Ships to you between
Thu. 02 May to Tue. 07 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
768 - Global Stock


Ships to you between
Thu. 02 May to Tue. 07 May

MOQ : 1
Multiples : 1

Stock Image

W25Q128JVSIM
Winbond

1 : USD 1.2805
10 : USD 1.0849
30 : USD 0.9761
90 : USD 0.7825
540 : USD 0.728
990 : USD 0.7038

2243 - Global Stock


Ships to you between Wed. 01 May to Fri. 03 May

MOQ : 1
Multiples : 1

Stock Image

W25Q128JVSIM
Winbond

1 : USD 1.7871
10 : USD 1.618
90 : USD 1.461
540 : USD 1.4369
1080 : USD 1.3765
2520 : USD 1.3403
5040 : USD 1.2921
25020 : USD 1.2921

2182 - Global Stock


Ships to you between Thu. 25 Apr to Wed. 01 May

MOQ : 90
Multiples : 90

Stock Image

W25Q128JVSIM
Winbond

90 : USD 2.1039
540 : USD 2.0618

18 - Global Stock


Ships to you by Fri. 19 Apr

MOQ : 1
Multiples : 1

Stock Image

W25Q128JVSIM
Winbond

1 : USD 2.5321
100 : USD 2.8135
75 : USD 3.3762
50 : USD 3.7513
1 : USD 7.5025

     
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W25Q128JV-DTR 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI & DTR For Industrial & Industrial Plus Grade Publication Release Date: March 02, 2018 -Revision C W25Q128JV-DTR Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 6 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm / 8x6-mm ................................................... 6 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.5 Pin Description SOIC 300-mil ............................................................................................... 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET) .................................................................................................................... 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI / QPI Operations .......................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 12 6.1.4 QPI Instructions .................................................................................................................... 12 6.1.5 SPI / QPI DTR Read Instructions ......................................................................................... 12 6.1.6 Hold Function ....................................................................................................................... 12 6.1.7 Software Reset & Hardware /RESET pin .............................................................................. 13 6.2 Write Protection .................................................................................................................. 14 6.2.1 Write Protect Features ......................................................................................................... 14 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 15 7.1 Status Registers ................................................................................................................. 15 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 15 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 15 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................ 15

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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