Product Information

W25Q257JVFIQ

W25Q257JVFIQ electronic component of Winbond

Datasheet
NOR Flash spiFlash, 3V, 256M-bit, 4Kb Uniform Sector, 4-Byte (default) / 3-Byte Address Modes

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 3.7879 ea
Line Total: USD 3.79

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 29 May to Tue. 04 Jun

MOQ : 44
Multiples : 1

Stock Image

W25Q257JVFIQ
Winbond

44 : USD 4.2884
220 : USD 4.1335
440 : USD 4.1222
1100 : USD 4.0743
2640 : USD 4.0306

0 - WHS 2


Ships to you between Tue. 04 Jun to Thu. 06 Jun

MOQ : 220
Multiples : 220

Stock Image

W25Q257JVFIQ
Winbond

220 : USD 3.3642
440 : USD 3.3012
1100 : USD 3.213
2640 : USD 3.213
5060 : USD 3.1752

     
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W25Q257JV 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: May 03, 2017 Revision B W25Q257JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 6 3.2 Pad Description WSON 8x6-mm .......................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 4. PIN DESCRIPTIONS ........................................................................................................................ 8 4.1 Chip Select (/CS) .................................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 8 4.3 Write Protect (/WP) .............................................................................................................. 8 4.4 HOLD (/HOLD) ..................................................................................................................... 8 4.5 Serial Clock (CLK) ................................................................................................................ 8 (1) 4.6 Reset (/RESET) ................................................................................................................. 8 5. BLOCK DIAGRAM ............................................................................................................................ 9 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 10 6.1 SPI Operations ................................................................................................................... 10 6.1.1 Standard SPI Instructions ..................................................................................................... 10 6.1.2 Dual SPI Instructions ............................................................................................................ 10 6.1.3 Quad SPI Instructions ........................................................................................................... 10 6.1.4 3-Byte / 4-Byte Address Modes ............................................................................................ 11 6.1.5 Software Reset & Hardware /RESET pin .............................................................................. 12 6.2 Write Protection .................................................................................................................. 13 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 14 7.1 Status Registers ................................................................................................................. 14 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 14 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 14 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable ....................... 15 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 15 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 15 7.1.1 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ............................... 16 7.1.2 Erase/Program Suspend Status (SUS) Status Only....................................................... 17 7.1.3 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable .......... 17 7.1.4 Quad Enable (QE) Volatile/Non-Volatile Writable .......................................................... 17 7.1.5 Current Address Mode (ADS) Status Only ..................................................................... 18 7.1.6 Power-Up Address Mode (ADP) Non-Volatile Writable .................................................. 18 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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