Product Information

W25Q64JVSFIQ TR

W25Q64JVSFIQ TR electronic component of Winbond

Datasheet
FLASH - NOR Memory IC 64Mb (8M x 8) SPI - Quad I/O 133 MHz 16-SOIC

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.1339 ea
Line Total: USD 1.13

927 - Global Stock
Ships to you between
Tue. 28 May to Thu. 30 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2910 - WHS 1


Ships to you between Wed. 22 May to Tue. 28 May

MOQ : 1000
Multiples : 1000
1000 : USD 0.8732

1857 - WHS 2


Ships to you between Wed. 22 May to Tue. 28 May

MOQ : 1
Multiples : 1
1 : USD 1.0355
10 : USD 1.0101
25 : USD 1.0001
100 : USD 0.9169
250 : USD 0.8986
500 : USD 0.8986
1000 : USD 0.8986

927 - WHS 3


Ships to you between Tue. 28 May to Thu. 30 May

MOQ : 1
Multiples : 1
1 : USD 1.1339
10 : USD 1.0442
100 : USD 0.9648
500 : USD 0.9614
1000 : USD 0.79

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Series
Memory Size
Maximum Clock Frequency
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Brand
Moisture Sensitive
Product Type
Factory Pack Quantity :
Subcategory
Tradename
LoadingGif

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W25Q64JV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI Publication Release Date: March 27, 2018 Revision J W25Q64JV Table of Contents 1. GENERAL DESCRIPTIONS .................................................................................................................. 4 2. FEATURES ............................................................................................................................................ 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS ............................................................................... 5 3.1 Pin Configuration SOIC 208-mil ................................................................................................ 5 3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm .................................................. 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm ............................... 5 3.4 Pin Configuration SOIC 300-mil ................................................................................................ 6 3.5 Pin Description SOIC 300-mil .................................................................................................... 6 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ...................................................... 7 3.7 Ball Description TFBGA 5x5 or 8x6-mm ................................................................................... 7 3.8 Ball Configuration WLCSP ........................................................................................................ 8 3.9 Ball Description WLCSP12 ........................................................................................................ 8 4. PIN DESCRIPTIONS ............................................................................................................................. 9 4.1 Chip Select (/CS) ....................................................................................................................... 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ......................................... 9 4.3 Write Protect (/WP) .................................................................................................................... 9 4.4 HOLD (/HOLD) .......................................................................................................................... 9 4.5 Serial Clock (CLK) ..................................................................................................................... 9 (1) 4.6 Reset (/RESET) ...................................................................................................................... 9 5. BLOCK DIAGRAM ............................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS .......................................................................................................... 11 6.1 Standard SPI Instructions ........................................................................................................ 11 6.2 Dual SPI Instructions ............................................................................................................... 11 6.3 Quad SPI Instructions.............................................................................................................. 11 6.4 Software Reset & Hardware /RESET pin ................................................................................ 11 6.5 Write Protection ....................................................................................................................... 12 Write Protect Features ............................................................................................................... 12 7. STATUS AND CONFIGURATION REGISTERS ................................................................................. 13 7.1 Status Registers ...................................................................................................................... 13 Erase/Write In Progress (BUSY) Status Only ...................................................................... 13 Write Enable Latch (WEL) Status Only ................................................................................ 13 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ...................................... 13 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ............................................. 14 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ............................................. 14 Complement Protect (CMP) Volatile/Non-Volatile Writable ................................................. 14 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ..................................... 15 Erase/Program Suspend Status (SUS) Status Only ............................................................ 16 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ................ 16 Quad Enable (QE) Volatile/Non-Volatile Writable ................................................................ 16 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ............................................. 17 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable ................................. 17 Publication Release Date: March 27, 2018 - 1 - Revision J

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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