W63CH6MBVABI TR Winbond

W63CH2MBV / W63CH6MBV 4Gb LPDDR3 Table of Contents- 1. GENERAL DESCRIPTION ............................................................................................................................................ 5 2. FEATURES .................................................................................................................................................................... 5 3. ORDER INFORMATION ................................................................................................................................................ 5 4. BALL ASSIGNMENT ..................................................................................................................................................... 6 5. BALL CONFIGURATION ............................................................................................................................................... 7 5.1 Ball Description .............................................................................................................................................................. 7 5.2 Addressing Table ........................................................................................................................................................... 8 6. BLOCK DIAGRAM ......................................................................................................................................................... 9 7. FUNCTIONAL DESCRIPTION ..................................................................................................................................... 10 7.1 Simplified LPDDR3 State Diagram .............................................................................................................................. 10 7.1.1 Simplified Bus Interface State Diagram ....................................................................................................................... 11 7.2 Power-up, Initialization, and Power-Off ........................................................................................................................ 12 7.2.1 Voltage Ramp and Device Initialization ........................................................................................................................ 12 7.2.2 Initialization after Reset (without Power ramp) ............................................................................................................. 14 7.2.3 Power-off Sequence .................................................................................................................................................... 14 7.2.4 Uncontrolled Power-Off Sequence .............................................................................................................................. 14 7.3 Mode Register Definition .............................................................................................................................................. 15 7.3.1 Mode Register Assignment and Definition ................................................................................................................... 15 7.3.1.1 Mode Register Assignment ............................................................................................................................... 15 7.3.2 MR0 Device Information (MA 7:0 = 00H) ................................................................................................................... 16 7.3.3 MR1 Device Feature 1 (MA 7:0 = 01H) ...................................................................................................................... 16 7.3.3.1 Burst Sequence ................................................................................................................................................ 17 7.3.4 MR2 Device Feature 2 (MA 7:0 = 02H) ...................................................................................................................... 17 7.3.5 MR3 I/O Configuration 1 (MA 7:0 = 03H) ................................................................................................................... 18 7.3.6 MR4 Device Temperature (MA 7:0 = 04H) ................................................................................................................. 18 7.3.7 MR5 Basic Configuration 1 (MA 7:0 = 05H) ............................................................................................................... 18 7.3.8 MR6 Basic Configuration 2 (MA 7:0 = 06H) ............................................................................................................... 19 7.3.9 MR7 Basic Configuration 3 (MA 7:0 = 07H) ............................................................................................................... 19 7.3.10 MR8 Basic Configuration 4 (MA 7:0 = 08H) ............................................................................................................... 19 7.3.11 MR9 (Reserved) (MA 7:0 = 09H) ............................................................................................................................... 19 7.3.12 MR10 Calibration (MA 7:0 = 0AH) ............................................................................................................................. 19 7.3.13 MR11 ODT Control (MA 7:0 = 0BH) .......................................................................................................................... 20 7.3.14 MR12:15 (Reserved) (MA 7:0 = 0CH-OFH) ............................................................................................................... 20 7.3.15 MR16 PASR Bank Mask (MA 7:0 = 10H) .................................................................................................................. 20 7.3.16 MR17 PASR Segment Mask (MA 7:0 = 11H) ............................................................................................................ 20 7.3.17 MR18:31 (Reserved) (MA 7:0 = 12H-1FH) ................................................................................................................ 21 7.3.18 MR32 DQ Calibration Pattern A (MA 7:0 = 20H) ........................................................................................................ 21 7.3.19 MR33:39 ( Do Not Use) (MA 7:0 = 21H-27H) ............................................................................................................. 21 7.3.20 MR40 DQ Calibration Pattern B (MA 7:0 = 28H) ........................................................................................................ 21 7.3.21 MR41 CA Training 1 (MA 7:0 = 29H) ....................................................................................................................... 21 7.3.22 MR42 CA Training 2 (MA 7:0 = 2AH) ....................................................................................................................... 21 7.3.23 MR43:47 ( Do Not Use) (MA 7:0 = 2BH-2FH) ............................................................................................................ 21 7.3.24 MR48 CA Training 3 (MA 7:0 = 30H) ....................................................................................................................... 21 7.3.25 MR49:62 (Reserved) (MA 7:0 = 31H-3EH) ................................................................................................................ 21 7.3.26 MR63 Reset (MA 7:0 = 3FH) ..................................................................................................................................... 21 7.3.27 MR64:255 (Reserved) (MA 7:0 = 40H-FFH) .............................................................................................................. 21 7.4 Command Definitions and Timing Diagrams ................................................................................................................ 22 7.4.1 Activate Command ...................................................................................................................................................... 22 7.4.1.1 8-Bank Device Operation .................................................................................................................................. 22 7.4.2 Command Input Signal Timing Definition ..................................................................................................................... 23 7.4.2.1 CKE Input Setup and Hold Timing .................................................................................................................... 24 7.4.3 Read and Write Access Modes.................................................................................................................................... 24 7.4.4 Burst Read Operation .................................................................................................................................................. 24 Publication Release Date: Nov. 23, 2018 Revision: A01-001 - 1 - W63CH2MBV / W63CH6MBV 7.4.5 Burst Write Operation .................................................................................................................................................. 29 7.4.5.1 t Calculation ............................................................................................................................................... 30 WPRE 7.4.5.2 t Calculation................................................................................................................................................ 30 WPST 7.4.6 Write Data Mask .......................................................................................................................................................... 32 7.4.7 Precharge Operation ................................................................................................................................................... 33 7.4.7.1 Burst Read Operation Followed by Precharge .................................................................................................. 33 7.4.7.2 Burst Write Followed by Precharge ................................................................................................................... 34 7.4.8 Auto Precharge Operation ........................................................................................................................................... 34 7.4.8.1 Burst Read with Auto-Precharge ....................................................................................................................... 35 7.4.8.2 Burst Write with Auto-Precharge ....................................................................................................................... 35 7.4.8.3 Precharge & Auto Precharge Clarification ......................................................................................................... 36 7.4.9 Refresh command ....................................................................................................................................................... 37 7.4.9.1 Refresh Command Scheduling Separation Requirements ................................................................................. 38 7.4.9.2 Refresh Requirements ...................................................................................................................................... 40 7.4.10 Self Refresh Operation ................................................................................................................................................ 41 7.4.11 Partial Array Self-Refresh (PASR) ............................................................................................................................... 43 7.4.11.1 PASR Bank Masking ......................................................................................................................................... 43 7.4.11.2 PASR Segment Masking................................................................................................................................... 43 7.4.12 Mode Register Read (MRR) Command ....................................................................................................................... 44 7.4.12.1 Temperature Sensor ......................................................................................................................................... 47 7.4.12.2 DQ Calibration .................................................................................................................................................. 48 7.4.13 Mode Register Write (MRW) Command ...................................................................................................................... 49 7.4.13.1 Mode Register Write ......................................................................................................................................... 50 7.4.13.1.1 MRW RESET .................................................................................................................................................... 50 7.4.13.2 Mode Register Write ZQ Calibration Command ................................................................................................ 51 7.4.13.2.1 ZQ External Resistor Value, Tolerance, and Capacitive Loading ...................................................................... 53 7.4.13.3 Mode Register Write CA Training Mode ......................................................................................................... 53 7.4.13.3.1 CA Training Sequence ...................................................................................................................................... 53 7.4.13.4 Mode Register Write WR Leveling Mode ........................................................................................................ 55 7.4.14 On-Die Termination ..................................................................................................................................................... 56 7.4.14.1 ODT Mode register ........................................................................................................................................... 56 7.4.14.2 Asynchronous ODT........................................................................................................................................... 56 7.4.14.3 ODT During Read Operations (RD or MRR)...................................................................................................... 57 7.4.14.4 ODT During Power Down .................................................................................................................................. 57 7.4.14.5 ODT During Self Refresh .................................................................................................................................. 57 7.4.14.6 ODT During Deep Power Down ........................................................................................................................ 57 7.4.14.7 ODT During CA Training and Write Leveling ..................................................................................................... 57 7.4.15 Power-Down ................................................................................................................................................................ 59 7.4.16 Deep Power-Down ...................................................................................................................................................... 64 7.4.17 Input clock stop and frequency change ........................................................................................................................ 65 7.4.18 No Operation Command .............................................................................................................................................. 66 7.5 Truth Tables ................................................................................................................................................................. 67 7.5.1 Command Truth Table ................................................................................................................................................. 67 7.5.2 CKE Truth Table.......................................................................................................................................................... 68 7.5.3 State Truth Tables ....................................................................................................................................................... 69 7.5.4 Data Mask Truth Table ................................................................................................................................................ 72 8. ELECTRICAL CHARACTERISTIC .............................................................................................................................. 73 8.1 Absolute Maximum DC Ratings ................................................................................................................................... 73 8.2 AC & DC Operating Conditions .................................................................................................................................... 73 8.2.1 Recommended DC Operating Conditions .................................................................................................................... 73 8.2.1.1 Recommended DC Operating Conditions ......................................................................................................... 73 8.2.2 Input Leakage Current ................................................................................................................................................. 74 8.2.3 Operating Temperature Range .................................................................................................................................... 74 8.2.4 AC and DC Input Measurement Levels ........................................................................................................................ 74 8.2.4.1 AC and DC Logic Input Levels for Single-Ended Signals................................................................................... 74 8.2.4.1.1 Single-Ended AC and DC Input Levels for CA and CS n Inputs ....................................................................... 74 8.2.4.1.2 Single-Ended AC and DC Input Levels for CKE ................................................................................................ 75 Publication Release Date: Nov. 23, 2018 Revision: A01-001 - 2 -