W956D8MBYA6I TR Winbond

W956D8MBYA / W956A8MBYA 64Mb HyperRAM Table of Contents- 1. FEATURES .................................................................................................................................................................................. 3 2. ORDER INFORMATION .............................................................................................................................................................. 3 3. BALL ASSIGNMENT.................................................................................................................................................................... 4 4. BALL DESCRIPTIONS ................................................................................................................................................................ 5 5. BLOCK DIAGRAM ....................................................................................................................................................................... 6 6. FUNCTIONAL DESCRIPTION ..................................................................................................................................................... 7 6.1 HyperBus Interface ........................................................................................................................................................ 7 7. HYPERBUS TRANSACTION DETAILS ..................................................................................................................................... 10 7.1 Command/Address Bit Assignments ............................................................................................................................ 10 7.2 Read Transactions ....................................................................................................................................................... 13 7.3 Write Transactions (Memory Array Write) .................................................................................................................... 15 7.4 Write Transactions without Initial Latency (Register Write) .......................................................................................... 17 8. MEMORY SPACE ...................................................................................................................................................................... 18 8.1 HyperBus Interface Memory Space addressing ........................................................................................................... 18 8.1.1 Density and Row Boundaries ......................................................................................................................... 18 9. REGISTER SPACE ................................................................................................................................................................... 19 9.1 HyperBus Interface Register Addressing ..................................................................................................................... 19 9.2 Register Space Access ................................................................................................................................................ 21 9.3 Device Identification Registers ..................................................................................................................................... 22 9.4 Configuration Register 0 .............................................................................................................................................. 22 9.4.1 Wrapped Burst ............................................................................................................................................... 23 9.4.2 Hybrid Burst ................................................................................................................................................... 24 9.4.3 Initial Latency ................................................................................................................................................. 25 9.4.4 Fixed Latency ................................................................................................................................................ 25 9.4.5 Drive Strength ................................................................................................................................................ 25 9.4.6 Deep Power Down ......................................................................................................................................... 25 9.5 Configuration Register 1 .............................................................................................................................................. 26 9.5.1 Master Clock Type ......................................................................................................................................... 26 9.5.2 Partial Array Refresh ...................................................................................................................................... 26 9.5.3 Hybrid Sleep .................................................................................................................................................. 27 9.5.4 Distributed Refresh Interval ........................................................................................................................... 27 10. INTERFACE STATES ................................................................................................................................................................ 28 10.1 IO condition of interface states..................................................................................................................................... 28 10.2 Power Conservation Modes ......................................................................................................................................... 29 10.2.1 Interface Standby ........................................................................................................................................... 29 10.2.2 Active Clock Stop ........................................................................................................................................... 29 10.2.3 Hybrid Sleep .................................................................................................................................................. 29 10.2.4 Deep Power Down ......................................................................................................................................... 30 11. ELECTRICAL SPECIFICATIONS .............................................................................................................................................. 31 11.1 Absolute Maximum Ratings ......................................................................................................................................... 31 11.2 Latch up Characteristics .............................................................................................................................................. 31 11.3 Operating Ranges ........................................................................................................................................................ 31 11.3.1 DC Characteristics ......................................................................................................................................... 31 11.3.2 Operating Temperature .................................................................................................................................. 31 The above information is the exclusive intellectual property of Winbond Electronics and shall not be disclosed, distributed or reproduced without permission from Winbond. Publication Release Date: Nov. 13, 2019 Revision: A01-002 - 1 - W956D8MBYA / W956A8MBYA 11.3.3 ICC Characteristics ........................................................................................................................................ 32 11.3.4 Power-Up Initialization ................................................................................................................................... 33 11.3.5 Power-Down .................................................................................................................................................. 35 11.3.6 Hardware Reset ............................................................................................................................................. 36 11.3.7 Capacitance Characteristics .......................................................................................................................... 37 11.4 Input Signal Overshoot ................................................................................................................................................ 37 12. TIMING SPECIFICATIONS ........................................................................................................................................................ 38 12.1 Key to Switching Waveforms ....................................................................................................................................... 38 12.2 AC Test Conditions ...................................................................................................................................................... 38 12.3 AC Characteristics ....................................................................................................................................................... 39 12.3.1 Read Transactions ......................................................................................................................................... 39 12.3.2 Write Transactions ......................................................................................................................................... 42 12.3.3 Hybrid Sleep Timings ..................................................................................................................................... 44 12.3.4 Deep Power down Timings ............................................................................................................................ 44 13. PACKAGE SPECIFICATION ..................................................................................................................................................... 45 14. REVISION HISTORY ................................................................................................................................................................. 46 The above information is the exclusive intellectual property of Winbond Electronics and shall not be disclosed, distributed or reproduced without permission from Winbond. Publication Release Date: Nov. 13, 2019 Revision: A01-002 - 2 -