W9712G6KB25I TR Winbond

W9712G6KB25I TR electronic component of Winbond
W9712G6KB25I TR Winbond
W9712G6KB25I TR DRAM
W9712G6KB25I TR  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W9712G6KB25I TR DRAM across the USA, India, Europe, Australia, and various other global locations. W9712G6KB25I TR DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

Part No. W9712G6KB25I TR
Manufacturer: Winbond
Category: DRAM
Description: DRAM 128Mb DDR2-800, x16 T&R
Datasheet: W9712G6KB25I TR Datasheet (PDF)
Price (USD)
1: USD 2.6 ea
Line Total: USD 2.6 
Availability - 2400
  
Ship by Tue. 29 Jul to Thu. 31 Jul
QtyUnit Price
1$ 2.6
10$ 2.1965
25$ 2.057
100$ 1.892
250$ 1.837
500$ 1.826
1000$ 1.716
2500$ 1.606

Availability 2400
Ship by Tue. 29 Jul to Thu. 31 Jul
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 2.6
10$ 2.1965
25$ 2.057
100$ 1.892
250$ 1.837
500$ 1.826
1000$ 1.716
2500$ 1.606

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Type
Mounting Style
Package / Case
Data Bus Width
Memory Size
Supply Voltage - Max
Supply Voltage - Min
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Organization
Brand
Hts Code
Product Type
Factory Pack Quantity :
Subcategory
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W9712G6KB25I TR from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W9712G6KB25I TR and other electronic components in the DRAM category and beyond.

Image Part-Description
Stock Image W971GG8SB25I
DRAM Chip DDR4 SDRAM 1Gbit 128Mx8 1.8V 60-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W971GG8SB-25
DRAM 1Gb, DDR2-800, x8
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W971GG8KB25I
DRAM Chip DDR2 SDRAM 1Gbit 128Mx8 1.8V 60-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W971GG6KB25I
DRAM Chip DDR2 SDRAM 1Gbit 64Mx16 1.8V 84-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W971GG6KB-25
DRAM Chip DDR2 SDRAM 1Gbit 64Mx16 1.8V 84-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9725G6KB-25
DRAM Chip DDR2 SDRAM 256Mbit 16Mx16 1.8V 84-Pin WBGA
Stock : 9
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W971GG6SB-25
8M X 8 Banks X 16 BIT DDR2 SDRAM
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W971GG6SB25I
DRAM 1Gb, DDR2-800, x16, Ind temp
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W971GG6SB-25TR
DDR DRAM 1Gb (64M x 16) Parallel WBGA-84 RoHS
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W971GG6SB-18
DRAM 1Gb, DDR2-1066, x16
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Image Part-Description
Stock Image MT40A1G8WE-083E IT:B
DRAM Chip DDR4 SDRAM 8G-Bit 1Gx8 1.2V 78-Pin FBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT40A1G8WE-075E:B
DRAM Chip DDR4 SDRAM 8G-Bit 1Gx8 1.2V 78-Pin FBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT40A512M16JY-083E AUT:B
MICMT40A512M16JY-083E AUT:B
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT53D1024M32D4DT-053 WT:D
DRAM LPDDR4 32G 1GX32 FBGA QDP
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image EDB8164B4PT-1DAT-F-D
DRAM Chip LPDDR2 SDRAM 8Gbit 128M X 64 256-Ball BGA T/R
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT40A256M16GE-083E AAT:B
DDR4 4G 256MX16 FBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image AS4C128M8D3B-12BCN
DRAM Chip DDR3 SDRAM 1Gbit 128M X 8 78-Pin FBGA Tray
Stock : 325
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT46H32M32LFB5-5 IT:B
DRAM Chip Mobile LPDDR SDRAM 1G-Bit 32Mx32 1.8V 90-Pin VF-BGA Tray
Stock : 1447
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT40A2G4SA-062E:J TR
DRAM DDR4 8G 2GX4 FBGA
Stock : 1117
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT40A1G8SA-062E:J TR
DRAM DDR4 8G 1GX8 FBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

W9712G6KB 2M 4 BANKS 16 BIT DDR2 SDRAM Table of Contents- 1. GENERAL DESCRIPTION ................................................................................................................... 4 2. FEATURES ........................................................................................................................................... 4 3. ORDER INFORMATION ....................................................................................................................... 4 4. KEY PARAMETERS ............................................................................................................................. 5 5. BALL CONFIGURATION ...................................................................................................................... 6 6. BALL DESCRIPTION ............................................................................................................................ 7 7. BLOCK DIAGRAM ................................................................................................................................ 8 8. FUNCTIONAL DESCRIPTION .............................................................................................................. 9 8.1 Power-up and Initialization Sequence ................................................................................................... 9 8.2 Mode Register and Extended Mode Registers Operation ................................................................... 10 8.2.1 Mode Register Set Command (MRS)............................................................................... 10 8.2.2 Extend Mode Register Set Commands (EMRS) .............................................................. 11 8.2.2.1 Extend Mode Register Set Command (1), EMR (1) ................................................ 11 8.2.2.2 DLL Enable/Disable ................................................................................................ 12 8.2.2.3 Extend Mode Register Set Command (2), EMR (2) ................................................ 13 8.2.2.4 Extend Mode Register Set Command (3), EMR (3) ................................................ 14 8.2.3 Off-Chip Driver (OCD) Impedance Adjustment ................................................................ 15 8.2.3.1 Extended Mode Register for OCD Impedance Adjustment .................................... 16 8.2.3.2 OCD Impedance Adjust .......................................................................................... 16 8.2.3.3 Drive Mode ............................................................................................................. 17 8.2.4 On-Die Termination (ODT) ............................................................................................... 18 8.2.5 ODT related timings ......................................................................................................... 18 8.2.5.1 MRS command to ODT update delay ..................................................................... 18 8.3 Command Function ............................................................................................................................. 20 8.3.1 Bank Activate Command .................................................................................................. 20 8.3.2 Read Command ............................................................................................................... 20 8.3.3 Write Command ............................................................................................................... 21 8.3.4 Burst Read with Auto-precharge Command ..................................................................... 21 8.3.5 Burst Write with Auto-precharge Command ..................................................................... 21 8.3.6 Precharge All Command .................................................................................................. 21 8.3.7 Self Refresh Entry Command .......................................................................................... 21 8.3.8 Self Refresh Exit Command ............................................................................................. 22 8.3.9 Refresh Command ........................................................................................................... 22 8.3.10 No-Operation Command .................................................................................................. 23 8.3.11 Device Deselect Command .............................................................................................. 23 8.4 Read and Write access modes ........................................................................................................... 23 8.4.1 Posted CAS ................................................................................................................... 23 CAS 8.4.1.1 Examples of posted operation ..................................................................... 23 8.4.2 Burst mode operation ....................................................................................................... 24 8.4.3 Burst read mode operation ............................................................................................... 25 8.4.4 Burst write mode operation .............................................................................................. 25 8.4.5 Write data mask ............................................................................................................... 26 8.5 Burst Interrupt ..................................................................................................................................... 26 8.6 Precharge operation ............................................................................................................................ 27 Publication Release Date: Apr. 13, 2018 Revision: A06 - 1 - W9712G6KB 8.6.1 Burst read operation followed by precharge ..................................................................... 27 8.6.2 Burst write operation followed by precharge .................................................................... 27 8.7 Auto-precharge operation ................................................................................................................... 27 8.7.1 Burst read with Auto-precharge ....................................................................................... 28 8.7.2 Burst write with Auto-precharge ....................................................................................... 28 8.8 Refresh Operation ............................................................................................................................... 29 8.9 Power Down Mode .............................................................................................................................. 29 8.9.1 Power Down Entry ........................................................................................................... 30 8.9.2 Power Down Exit .............................................................................................................. 30 8.10 Input clock frequency change during precharge power down ............................................................. 30 9. OPERATION MODE ........................................................................................................................... 31 9.1 Command Truth Table ........................................................................................................................ 31 9.2 Clock Enable (CKE) Truth Table for Synchronous Transitions ........................................................... 32 9.3 Data Mask (DM) Truth Table ............................................................................................................... 32 9.4 Function Truth Table ........................................................................................................................... 33 9.5 Simplified Stated Diagram ................................................................................................................... 36 10. ELECTRICAL CHARACTERISTICS ................................................................................................... 37 10.1 Absolute Maximum Ratings ................................................................................................................ 37 10.2 Operating Temperature Condition ....................................................................................................... 37 10.3 Recommended DC Operating Conditions ........................................................................................... 37 10.4 ODT DC Electrical Characteristics ...................................................................................................... 38 10.5 Input DC Logic Level ........................................................................................................................... 38 10.6 Input AC Logic Level ........................................................................................................................... 38 10.7 Capacitance ........................................................................................................................................ 39 10.8 Leakage and Output Buffer Characteristics ........................................................................................ 39 10.9 DC Characteristics .............................................................................................................................. 40 10.10 IDD Measurement Test Parameters .......................................................................................... 42 10.11 AC Characteristics ..................................................................................................................... 43 10.12 AC Input Test Conditions ........................................................................................................... 64 10.13 Differential Input/Output AC Logic Levels .................................................................................. 64 10.14 AC Overshoot / Undershoot Specification ................................................................................. 65 10.14.1 AC Overshoot / Undershoot Specification for Address and Control Pins: ........................ 65 10.14.2 AC Overshoot / Undershoot Specification for Clock, Data, Strobe and Mask pins: .......... 65 11. TIMING WAVEFORMS ....................................................................................................................... 66 11.1 Command Input Timing ....................................................................................................................... 66 11.2 ODT Timing for Active/Standby Mode ................................................................................................. 67 11.3 ODT Timing for Power Down Mode .................................................................................................... 67 11.4 ODT Timing mode switch at entering power down mode .................................................................... 68 11.5 ODT Timing mode switch at exiting power down mode ...................................................................... 69 11.6 Data output (read) timing .................................................................................................................... 70 11.7 Burst read operation: RL=5 (AL=2, CL=3, BL=4) ................................................................................ 70 11.8 Data input (write) timing ...................................................................................................................... 71 11.9 Burst write operation: RL=5 (AL=2, CL=3, WL=4, BL=4) .................................................................... 71 11.10 Seamless burst read operation: RL = 5 ( AL = 2, and CL = 3, BL = 4) ...................................... 72 11.11 Seamless burst write operation: RL = 5 ( WL = 4, BL = 4) ......................................................... 72 11.12 Burst read interrupt timing: RL =3 (CL=3, AL=0, BL=8) ............................................................. 73 11.13 Burst write interrupt timing: RL=3 (CL=3, AL=0, WL=2, BL=8) .................................................. 73 11.14 Write operation with Data Mask: WL=3, AL=0, BL=4) ............................................................... 74 11.15 Burst read operation followed by precharge: RL=4 (AL=1, CL=3, BL=4, tRTP 2clks) ............ 75 11.16 Burst read operation followed by precharge: RL=4 (AL=1, CL=3, BL=8, tRTP 2clks) ............ 75 Publication Release Date: Apr. 13, 2018 Revision: A06 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
22.23.9.012.4000 Finder Relay – 12V DPDT Plug-In Type image

Jun 3, 2025
The 22.23.9.012.4000 General Purpose Relays by Finder feature a 12V DC coil, DPDT contacts, and 8A rating—ideal for control panels, HVAC, and automation with reliable switching.
SMBJ15CA ESD Suppressors/TVS Diodes by DIYI image

Jul 24, 2025
SMBJ15CA ESD Suppressors/TVS Diodes by DIYI offer 600W bidirectional protection for 15V circuits. Compact DO-214AA package ideal for global ESD protection needs.
206305-1 Standard Circular Connector Retailer in India, USA image

Oct 16, 2024
The 206305-1 Standard Circular Connector by TE Connectivity is a 37-position plug with a shell size of 23, designed for demanding applications in aerospace, defense, industrial automation, and telecommunications. This high-performance connector offers gold-plated contacts for superior conductiv
AP-ISD32GID4B-8T Memory Card – 32GB SLC by Apacer image

Jun 25, 2025
The AP-ISD32GID4B-8T by Apacer is a rugged 32GB industrial  Memory Card  with SLC NAND for extreme environments. Ideal for  Embedded Solutions  needing reliable  Memory & Data Storage  across global applications.

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON Electronics
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2025  X-ON Electronics Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing. All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted AS9120 Certified