X-On Electronics has gained recognition as a prominent supplier of W972GG6KB25I DRAM across the USA, India, Europe, Australia, and various other global locations. W972GG6KB25I DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W972GG6KB25I Winbond

W972GG6KB25I electronic component of Winbond
W972GG6KB25I Winbond
W972GG6KB25I DRAM
W972GG6KB25I  Semiconductors

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Part No. W972GG6KB25I
Manufacturer: Winbond
Category: DRAM
Description: DDR2 SDRAM 16M X 8 BANKS X 16 BIT
Datasheet: W972GG6KB25I Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 15.939 ea
Line Total: USD 15.94 
Availability - 320
Ship by Thu. 12 Jun to Mon. 16 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
320
Ship by Thu. 12 Jun to Mon. 16 Jun
MOQ : 1
Multiples : 1
1 : USD 15.939
10 : USD 12.6126
25 : USD 12.0005
50 : USD 11.8503
100 : USD 11.1226
288 : USD 10.8454
576 : USD 10.0138
1008 : USD 9.829
2592 : USD 9.8175

   
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We are delighted to provide the W972GG6KB25I from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W972GG6KB25I and other electronic components in the DRAM category and beyond.

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W972GG6KB 16M 8 BANKS 16 BIT DDR2 SDRAM Table of Contents- 1. GENERAL DESCRIPTION ................................................................................................................... 4 2. FEATURES ........................................................................................................................................... 4 3. ORDER INFORMATION ....................................................................................................................... 4 4. KEY PARAMETERS ............................................................................................................................. 5 5. BALL CONFIGURATION ...................................................................................................................... 6 6. BALL DESCRIPTION ............................................................................................................................ 7 7. BLOCK DIAGRAM ................................................................................................................................ 8 8. FUNCTIONAL DESCRIPTION .............................................................................................................. 9 8.1 Power-up and Initialization Sequence ................................................................................................... 9 8.2 Mode Register and Extended Mode Registers Operation ................................................................... 10 8.2.1 Mode Register Set Command (MRS)............................................................................... 10 8.2.2 Extend Mode Register Set Commands (EMRS) .............................................................. 11 8.2.2.1 Extend Mode Register Set Command (1), EMR (1) ................................................ 11 8.2.2.2 DLL Enable/Disable ................................................................................................ 12 8.2.2.3 Extend Mode Register Set Command (2), EMR (2) ................................................ 13 8.2.2.4 Extend Mode Register Set Command (3), EMR (3) ................................................ 14 8.2.3 Off-Chip Driver (OCD) Impedance Adjustment ................................................................ 15 8.2.3.1 Extended Mode Register for OCD Impedance Adjustment .................................... 16 8.2.3.2 OCD Impedance Adjust .......................................................................................... 16 8.2.3.3 Drive Mode ............................................................................................................. 17 8.2.4 On-Die Termination (ODT) ............................................................................................... 18 8.2.5 ODT related timings ......................................................................................................... 18 8.2.5.1 MRS command to ODT update delay ..................................................................... 18 8.3 Command Function ............................................................................................................................. 20 8.3.1 Bank Activate Command .................................................................................................. 20 8.3.2 Read Command ............................................................................................................... 21 8.3.3 Write Command ............................................................................................................... 21 8.3.4 Burst Read with Auto-precharge Command ..................................................................... 21 8.3.5 Burst Write with Auto-precharge Command ..................................................................... 21 8.3.6 Precharge All Command .................................................................................................. 21 8.3.7 Self Refresh Entry Command .......................................................................................... 21 8.3.8 Self Refresh Exit Command ............................................................................................. 22 8.3.9 Refresh Command ........................................................................................................... 22 8.3.10 No-Operation Command .................................................................................................. 23 8.3.11 Device Deselect Command .............................................................................................. 23 8.4 Read and Write access modes ........................................................................................................... 23 8.4.1 Posted CAS ................................................................................................................... 23 CAS 8.4.1.1 Examples of posted operation ..................................................................... 23 8.4.2 Burst mode operation ....................................................................................................... 24 8.4.3 Burst read mode operation ............................................................................................... 25 8.4.4 Burst write mode operation .............................................................................................. 25 8.4.5 Write data mask ............................................................................................................... 26 8.5 Burst Interrupt ..................................................................................................................................... 26 8.6 Precharge operation ............................................................................................................................ 27 Publication Release Date: Feb. 13, 2017 Revision: A03 - 1 - W972GG6KB 8.6.1 Burst read operation followed by precharge ..................................................................... 27 8.6.2 Burst write operation followed by precharge .................................................................... 27 8.7 Auto-precharge operation ................................................................................................................... 27 8.7.1 Burst read with Auto-precharge ....................................................................................... 28 8.7.2 Burst write with Auto-precharge ....................................................................................... 28 8.8 Refresh Operation ............................................................................................................................... 29 8.9 Power Down Mode .............................................................................................................................. 29 8.9.1 Power Down Entry ........................................................................................................... 30 8.9.2 Power Down Exit .............................................................................................................. 30 8.10 Input clock frequency change during precharge power down ............................................................. 30 9. OPERATION MODE ........................................................................................................................... 31 9.1 Command Truth Table ........................................................................................................................ 31 9.2 Clock Enable (CKE) Truth Table for Synchronous Transitions ........................................................... 32 9.3 Data Mask (DM) Truth Table ............................................................................................................... 32 9.4 Function Truth Table ........................................................................................................................... 33 9.5 Simplified Stated Diagram ................................................................................................................... 36 10. ELECTRICAL CHARACTERISTICS ................................................................................................... 37 10.1 Absolute Maximum Ratings ................................................................................................................ 37 10.2 Operating Temperature Condition ....................................................................................................... 37 10.3 Recommended DC Operating Conditions ........................................................................................... 37 10.4 ODT DC Electrical Characteristics ...................................................................................................... 38 10.5 Input DC Logic Level ........................................................................................................................... 38 10.6 Input AC Logic Level ........................................................................................................................... 38 10.7 Capacitance ........................................................................................................................................ 39 10.8 Leakage and Output Buffer Characteristics ........................................................................................ 39 10.9 DC Characteristics .............................................................................................................................. 40 10.10 IDD Measurement Test Parameters .......................................................................................... 42 10.11 AC Characteristics ..................................................................................................................... 43 10.11.1 AC Characteristics and Operating Condition for -18 speed grade ................................... 43 10.11.2 AC Characteristics and Operating Condition for -25/25I/-3/-3I speed grade .................... 45 10.12 AC Input Test Conditions ........................................................................................................... 66 10.13 Differential Input/Output AC Logic Levels .................................................................................. 66 10.14 AC Overshoot / Undershoot Specification ................................................................................. 67 10.14.1 AC Overshoot / Undershoot Specification for Address and Control Pins: ........................ 67 10.14.2 AC Overshoot / Undershoot Specification for Clock, Data, Strobe and Mask pins: .......... 67 11. TIMING WAVEFORMS ....................................................................................................................... 68 11.1 Command Input Timing ....................................................................................................................... 68 11.2 ODT Timing for Active/Standby Mode ................................................................................................. 69 11.3 ODT Timing for Power Down Mode .................................................................................................... 69 11.4 ODT Timing mode switch at entering power down mode .................................................................... 70 11.5 ODT Timing mode switch at exiting power down mode ...................................................................... 71 11.6 Data output (read) timing .................................................................................................................... 72 11.7 Burst read operation: RL=5 (AL=2, CL=3, BL=4) ................................................................................ 72 11.8 Data input (write) timing ...................................................................................................................... 73 11.9 Burst write operation: RL=5 (AL=2, CL=3, WL=4, BL=4) .................................................................... 73 11.10 Seamless burst read operation: RL = 5 (AL = 2, and CL = 3, BL = 4) ....................................... 74 11.11 Seamless burst write operation: RL = 5 (WL = 4, BL = 4) .......................................................... 74 11.12 Burst read interrupt timing: RL =3 (CL=3, AL=0, BL=8) ............................................................. 75 11.13 Burst write interrupt timing: RL=3 (CL=3, AL=0, WL=2, BL=8) .................................................. 75 11.14 Write operation with Data Mask: WL=3, AL=0, BL=4) ............................................................... 76 Publication Release Date: Feb. 13, 2017 Revision: A03 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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