X-On Electronics has gained recognition as a prominent supplier of W9864G6JB-6I DRAM across the USA, India, Europe, Australia, and various other global locations. W9864G6JB-6I DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W9864G6JB-6I Winbond

W9864G6JB-6I electronic component of Winbond
W9864G6JB-6I Winbond
W9864G6JB-6I DRAM
W9864G6JB-6I  Semiconductors

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Part No. W9864G6JB-6I
Manufacturer: Winbond
Category: DRAM
Description: DRAM 64Mb SDR SDRAM x16, 166MHz, Ind Temp
Datasheet: W9864G6JB-6I Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 5.075 ea
Line Total: USD 5.08 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 20 Jun to Tue. 24 Jun
MOQ : 1
Multiples : 1
1 : USD 5.075
10 : USD 3.565
25 : USD 3.212
100 : USD 2.904
286 : USD 2.75
572 : USD 2.739
1144 : USD 2.706
2574 : USD 2.684
5148 : USD 2.618

   
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We are delighted to provide the W9864G6JB-6I from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W9864G6JB-6I and other electronic components in the DRAM category and beyond.

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W9864G6JB 1M 4 BANKS 16 BITS SDRAM Table of Contents- 1. GENERAL DESCRIPTION .............................................................................................................. 3 2. FEATURES ...................................................................................................................................... 3 3. ORDER INFORMATION .................................................................................................................. 4 4. BALL CONFIGURATION ................................................................................................................. 4 5. BALL DESCRIPTION ...................................................................................................................... 5 6. BLOCK DIAGRAM ........................................................................................................................... 6 7. FUNCTIONAL DESCRIPTION ........................................................................................................ 7 7.1 Power Up and Initialization ................................................................................................. 7 7.2 Programming Mode Register Set command ....................................................................... 7 7.3 Bank Activate Command .................................................................................................... 7 7.4 Read and Write Access Modes .......................................................................................... 7 7.5 Burst Read Command ........................................................................................................ 8 7.6 Burst Command .................................................................................................................. 8 7.7 Read Interrupted by a Read................................................................................................ 8 7.8 Read Interrupted by a Write ................................................................................................ 8 7.9 Write Interrupted by a Write ................................................................................................ 8 7.10 Write Interrupted by a Read ................................................................................................ 8 7.11 Burst Stop Command .......................................................................................................... 9 7.12 Addressing Sequence of Sequential Mode......................................................................... 9 7.13 Addressing Sequence of Interleave Mode .......................................................................... 9 7.14 Auto-precharge Command................................................................................................ 10 7.15 Precharge Command ........................................................................................................ 10 7.16 Self Refresh Command ..................................................................................................... 10 7.17 Power Down Mode ............................................................................................................ 11 7.18 No Operation Command ................................................................................................... 11 7.19 Deselect Command .......................................................................................................... 11 7.20 Clock Suspend Mode ........................................................................................................ 11 8. OPERATION MODE ...................................................................................................................... 12 9. ELECTRICAL CHARACTERISTICS ............................................................................................. 13 9.1 Absolute Maximum Ratings .............................................................................................. 13 9.2 Recommended DC Operating Conditions ........................................................................ 13 Publication Release Date: Mar. 22, 2017 - 1 - Revision A01 W9864G6JB 9.3 Capacitance ...................................................................................................................... 13 9.4 DC Characteristics ............................................................................................................ 14 9.5 AC Characteristics and Operating Condition .................................................................... 15 10. TIMING WAVEFORMS .................................................................................................................. 18 10.1 Command Input Timing ..................................................................................................... 18 10.2 Read Timing ...................................................................................................................... 19 10.3 Control Timing of Input/Output Data ................................................................................. 20 10.4 Mode Register Set Cycle .................................................................................................. 21 11. OPERATINOPERATING TIMING EXAMPLE ............................................................................... 22 11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) .......................................... 22 11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) ............... 23 11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) .......................................... 24 11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) ............... 25 11.5 Interleaved Bank Write (Burst Length = 8) ....................................................................... 26 11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge) ............................................ 27 11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3) ................................................... 28 11.8 Page Mode Read/Write (Burst Length = 8, CAS Latency = 3) ......................................... 29 11.9 Auto-precharge Read (Burst Length = 4, CAS Latency = 3) ............................................ 30 11.10 Auto-precharge Write (Burst Length = 4) .......................................................................... 31 11.11 Auto Refresh Cycle ........................................................................................................... 32 11.12 Self Refresh Cycle ............................................................................................................ 33 11.13 Bust Read and Single Write (Burst Length = 4, CAS Latency = 3) .................................. 34 11.14 Power down Mode ............................................................................................................ 35 11.15 Auto-precharge Timing (Write Cycle) ............................................................................... 36 11.16 Auto-precharge Timing (Read Cycle) ............................................................................... 37 11.17 Timing Chart of Read to Write Cycle ................................................................................ 38 11.18 Timing Chart of Write to Read Cycle ................................................................................ 38 11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command) ............................................... 39 11.20 Timing Chart of Burst Stop Cycle (Precharge Command) ................................................ 39 11.21 CKE/DQM Input Timing (Write Cycle) .............................................................................. 40 11.22 CKE/DQM Input Timing (Read Cycle) .............................................................................. 41 12. PACKAGE SPECIFICATION ......................................................................................................... 42 2 12.1 VFBGA 60 Balls (6.4x10.1 mm , Ball pitch:0.65mm, =0.4mm) ...................................... 42 13. REVISION HISTORY ..................................................................................................................... 43 Publication Release Date: Mar. 22, 2017 - 2 - Revision A01

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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