X-On Electronics has gained recognition as a prominent supplier of A3R2GE43JBF-8E DRAM across the USA, India, Europe, Australia, and various other global locations. A3R2GE43JBF-8E DRAM are a product manufactured by Zentel. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

A3R2GE43JBF-8E Zentel

A3R2GE43JBF-8E electronic component of Zentel
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Part No.A3R2GE43JBF-8E
Manufacturer: Zentel
Category: DRAM
Description: DRAM DDR2 2Gb, 128Mx16, 800 @CL5, 1.8V, FBGA-84
Datasheet: A3R2GE43JBF-8E Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 9.0965 ea
Line Total: USD 9.1 
Availability - 194
Ship by Wed. 13 Nov to Fri. 15 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
194
Ship by Wed. 13 Nov to Fri. 15 Nov
MOQ : 1
Multiples : 1
1 : USD 9.0965
10 : USD 8.51
25 : USD 8.3375
100 : USD 7.544
250 : USD 7.429
500 : USD 7.2105
2000 : USD 6.578

   
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We are delighted to provide the A3R2GE43JBF-8E from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the A3R2GE43JBF-8E and other electronic components in the DRAM category and beyond.

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Doc. No. DSA3R2GE43JBFF.01 A3R2GE43JBF 2Gb DDR2 SDRAM 2Gb DDR2 SDRAM Specification Specifications Features Density: 2G bits Double data-rate architecture: two data transfers per Organization clock cycle o 8 banks x 16M words x 16 bits The high-speed data transfer is realized by the 4 bits Package prefetch pipelined architecture o 84-ball FBGA (x16) Bi-directional differential data strobe (DQS and /DQS) is o Lead-free(RoHS compliant) transmitted/received with data for capturing data at the Power supply receiver o V ,V =1.7 to 1.9V DD DDQ DQS is edge-aligned with data for READs center- aligned Data Rate: 1066Mbps/800Mbps with data for WRITEs 2KB page size (x16) Differential clock inputs (CK and /CK) o Row address: AX0 to AX13 DLL aligns DQ and DQS transitions with CK transitions o Column address: AY0 to AY9 Commands entered on each positive CK edge data and Eight internal banks for concurrent operation data mask referenced to both edges of DQS Interface: SSTL 18 Data mask (DM) for write data o Burst lengths (BL): 4 , 8 Posted CAS by programmable additive latency for better Burst type (BT): command and data bus efficiency o Sequential On-Die-Termination for better signal quality o Interleave Programmable RDQS, /RDQS output for making x8 CAS latency (CL): 3, 4, 5, 6, 7 organization compatible with x4 organization Precharge: Auto precharge option for each burst access /DQS, (/RDQS) can be disabled for single-ended Data Driver strength: Normal/Weak Strobe operation Low self-refresh current (IDD6) parts are available Off-Chip Driver (OCD) impedance adjustment is not Refresh: auto-refresh, self-refresh supported Refresh cycles: 8192 cycles/64ms o Average auto-refresh period 7.8us at TC +85 3.9us at TC > +85 Operating case temperature range o TC = 0C to +85C (Commercial grade) Rev. 01 Dec. 22, 2020 1 of 25 Zentel Japan Corporation reserves the right to change products and/or specifications without notice. 2020 Zentel Japan Corporation. All rights reserved. Doc. No. DSA3R2GE43JBFF.01 A3R2GE43JBF 2Gb DDR2 SDRAM Table of Contents 2Gb DDR2 SDRAM Specification ...................................................................................................................... 1 1. Ordering Information ............................................................................................................................ 3 2. Package Ball Assignment ....................................................................................................................... 4 3. Package outline drawing........................................................................................................................ 5 4. Electrical Specifications: ........................................................................................................................ 6 5. Block Diagram ..................................................................................................................................... 15 6. Pin function ......................................................................................................................................... 16 7. Command Operation ........................................................................................................................... 18 8. Functional Description ......................................................................................................................... 19 Rev. 01 Dec. 22, 2020 2 of 25 Zentel Japan Corporation reserves the right to change products and/or specifications without notice. 2020 Zentel Japan Corporation. All rights reserved.

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
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